October 03, 2005
Catching Up with MIPS
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EVE Introduces Next-Generation Hardware-Assisted Verification Platform Series The first product in this series, the ZeBu-UF2 is an ultra-fast emulator that enables simultaneous hardware and embedded software verification. The ZeBu-UF Series can handle design capacity that ranges from 750,000 to six million application specific integrate circuit (ASIC) logic gates. Its memory capacity extends from 1.25 gigabits to four gigabits, and it has maximum performance that goes from 30 to 200 megahertz (MHz).
Structured ASICs to Solve Cost and Design Issues in the IC Industry Frost & Sullivan report on Emerging Trends in Structured ASIC/FPGA Technologies Impacting the Electronics Markets
LSI Logic Adopts Synopsys' New Design Planning Capabilities for Industry-Leading ASICs LSI Logic has integrated significant new capabilities of the Synopsys' JupiterXT Galaxy Design Planning solution into its FlexStream ASIC design flow. The key new features include automated macro placement and power network synthesis
Springer Publishes ARM-Synopsys Verification Methodology Manual for SystemVerilog Co-authored by ARM and Synopsys, the book documents years of know-how and industry best practices for architecting advanced, efficient verification environments using industry-standard SystemVerilog assertions, testbenches and functional coverage.
Other EDA News
Synfora to Streamline SoC Design With Tighter Integration of Its PICO System and Novas Tools; Leader in Application Engine Synthesis and Leader in Design Debug Systems Collaborate to Improve SoC Design
Accellera Co-Sponsors and Supports SystemVerilog and PSL Electronic Design Automation Standard Sessions at the FORUM on Specification & Design Languages
Synopsys Announces Industry's First Wireless USB Device Controller IP Based on the Certified Wireless USB Specification
ADVISORY/ VaST Systems Technology's Embedded System Design Automation Solutions Demonstrates Continued Support for ARM Architecture at ARM Developers' Conference
Synopsys and Realtek Collaborate to Provide Interoperable IP Solution for Certified Wireless USB Technology
Cadence Senior Vice President, Industry Alliances, Jan Willis, to Present at the 2005 FSA Suppliers Expo & Conference
Cadence Announces New Capabilities to Simplify and Accelerate PowerPC Design; Custom-Synthesized Design Approach Reduces Time to Market for PowerPC Designers
Sequence "Formalizes" Power-Grid Verification With CoolCheck; Vector Independent Approach Complements Static and Dynamic Analysis
Comit Systems Speeds Time to Market with Cadence Synthesis; Encounter RTL Compiler Global Synthesis Enhances Design House Competitiveness
Other IP & SoC News
Market Revenues for the April 2005 Worldwide Semiconductor Trade Outstripped the Revenues of April 2004 by 4.0%
FSA Hosts Annual Briefing at 2005 FSA Suppliers Expo and Conference; Discussion Highlights Association Initiatives
Cypress Introduces Zero-Delay Buffers With Best-in-Class Performance for High-Speed Communications and Consumer Devices
New 2-Axis Accelerometers from STMicroelectronics Pack Increased Performance into Smaller, Thinner Package
Worldwide MCU Units Shipped between 2004 and 2009 are Expected to Increase at an Annual CAGR of 10.3
High-Performance RF Transmit Signal Chain Demonstration Kit from TI Speeds Wireless Infrastructure Designs
Cypress Delivers Media Transfer Protocol Reference Design For Portable Media Players; New Design Enables Quick and Economical Digital Rights Management Implementation
Atmel Targets Low-frequency RFID Applications With Introduction of Contactless RF IDIC(R) Featuring Fast Anti-Collision Functionality and 1-kBit Memory
National Semiconductor Introduces Industry's First Synchronous Switching Controller in SOT-23 Package
UMC Targets Low-Power SoC Designs with Industry's Most Comprehensive Low-Power Reference Design Package
IDT Acquires Freescale Timing Solutions Business; Deal Further Demonstrates IDT Leadership in Communications Timing Market
Productivity Design Tools Tackles Chip-Development Productivity and IP Reuse Issues Through ESL Tools
Cypress Expands CMOS Image Sensor Portfolio with Suite of 1.3-Megapixel Imaging Solutions for Mobile Devices; Image Sensor and Fully Integrated System-on-a-Chip Image Sensor Deliver DSC-Like Quality on a 1/4-Inch Optical Format
Ziptronix Produces World's First Three-Dimensional System-on-Chip; Technological milestone proves benefits of ZiROC(R) bonding for 3D IC fabrication
Xignal Announces Breakthrough Analog-to-Digital Conversion Technology That Delivers High Speed, Very Low Power Consumption and Simplified System Design
National Semiconductor Introduces Six Precision and Low-Voltage Amplifiers Based on New Advanced BiCMOS Process
Atmel Extends Its Family of RF Car Access ICs With Introduction of Full Duplex RF Transceiver for Growing Passive Entry Go (PEG) Market
Micrel Launches New Post Amplifier Featuring Improved Sensitivity for Datacom and Telecom Digital Applications
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-- Jack Horgan, EDACafe.com Contributing Editor.
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