February 24, 2003
Virtual Snow Day
Please note that contributed articles, blog entries, and comments posted on EDACafe.com are the views and opinion of the author and do not necessarily represent the views and opinions of the management and staff of Internet Business Systems and its subsidiary web-sites.
Peggy Aycinena - Contributing Editor


by Peggy Aycinena - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by EDACafe.com. If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!

Also from Mentor - The company announced that fully supported Calibre DRC (design rule check) rule files are now available for 90-nanometer technologies from UMC. Calibre has been UMC's standard for physical verification since 1998. UMC is a member of Mentor's Design for Manufacture (DFM) Silicon Partners Program, which guarantees mutual customers a set of rule files for Calibre DRC, Calibre LVS, and Calibre xRC. Rule files can be downloaded from UMC's website.


National Semiconductor Corp. introduced a system solution for GSM/GPRS handsets, which integrates analog and wireless capabilities including audio, power management, Bluetooth connectivity, imaging interface, baseband, and RF into a module and chipset platform for mobile phone manufacturers. The integrated chipset is customizable to address end-user specifications including ODMs and OEMs needing a GSM/FPRS engine. Both the chipset and module come with full development kits. The LMX3888 module includes an on-chip polyphonic ringer, speakerphone, stereo MP3 capabilities, an integrated Bluetooth Link Manager, USB, CMOS camera interface, SD/MMC interface, voice recognition, voice memo,
hands-free speakerphone, EMS and MMS. The chipset and module are currently sampling to select customers and will be available for general sampling in June 2003.


Open Core Protocol International Partnership (OCP-IP) announced that TNI-Valiosys has joined the organization as a Sponsor Member, thereby supporting OCP-IP's efforts to create a common standard for IP core interfaces to facilitate plug-and-play SoC (system-on-chip) design. The company says that adoption of an industry-standard interface will permit TNI-Valiosys to make its formal solution available to more designers and increase IP reuse.


Pericom Semiconductor Corp. announced a new family of low voltage differential signaling (LVDS) devices that support high-speed data transfer. LVDS is used in applications requiring high-speed data transfer, low power, or low EMI. The seven new devices support Pericom's portfolio of low voltage differential signaling products. LVDS is a differential standard using two signal lines to communicate data or clock signals over PCB traces or balanced cables such that noise is decreased on the line through common-mode rejection. Since there is less noise than a single-ended method of transmission, the signal can be dropped to the millivolt level. The small signal swings allow for faster
data rates because of the short rise times. Pericom's new LVDS devices are available now for general sampling.


Rambus Inc. introduced its parallel bus logic interface family, code-named Redwood, for high volume, low-cost systems. The Redwood family of products includes a per pin data rate of 400MHz to 6.4GHz and is optimized for low latency and low power parallel bus applications. Redwood can be backwards compatible with existing LVDS-based standards such as HyperTransport, SPI-4, and RapidIO, and therefore, offers a range of frequency and voltage support. Elements integrated into the Redwood technology include low-voltage differential signaling, FlexPhase timing calibration circuit technology, and dynamic current and termination capabilities. The Redwood family of parallel bus logic
interfaces is available now for licensing.


Synplicity, Inc. announced it has enhanced its Amplify Physical Optimizer software for physical synthesis of FPGA designers, by extending its MultiPoint technology and interactive timing analysis applicable to system-on-a-programmable-chip (SOPC) devices. Additionally, Synplicity now offers support for Altera's Stratix GX and Cyclone devices, and has enhanced its support for the Xilinx Virtex II-Pro devices.


Texas Instruments Inc. announced four new GSM/GPRS chipsets as additions to the TCS family of chipsets. The latest additions to TI's GSM/GPRS chipset family include the TCS2600, TCS2620, TCS2200, and TCS2010 with low power consumption, reduced board space, and increased component-level integration. The company says the new chipsets are capable of supporting various applications including secure m-commerce, multimedia games and entertainment, location-based services, streaming media, accelerated Java processing, web browsing, and enhanced 2D graphics. The TCS2600 includes the OMAP730 smartphone processor and a Class 12 GPRS modem with an ARM926 general- purpose processing core. The
TCS2620 chipset includes the OMAP732 processor, plus up to 256 Mb of stacked mobile SDRAM. The two other new chipsets, the TCS2200 and the TCS2010, are based on the same architecture as TI's TCS2100, a Class 12 GSM/GPRS chipset.
All of the new TCS chipsets will be supported by development tools and handset reference designs. Sampling and production availability of the 4 chipsets will roll out across 2003.


TNI-Valiosys - The company announced the first release of the forthcoming OCP2.0 Formal Compliance Checks (OCP2.0 FCC) library of assertions to be used in conjunction with the company's static property checking tool, imPROVE-HDL. The company is contributing two one-year subscription licenses of the OCP2.0 FCC library free of charge to all OCP-IP Governing Steering Committee members.


Toshiba America Electronic Components, Inc. (TAEC) announced the introduction of the first products in a new series of high-speed 8-bit microcontrollers suitable for portable battery-powered applications. The TMP86FM48U and TMP86FM48F are capable of operating at 8 MHz and 1.8 V. The TMP86FM48U/F has 512 bytes of built-in data EEPROM and incorporates Flash memory that can be programmed via the Universal Asynchronous Receiver Transmitter (UART), making it possible to program and reprogram the device after the chip has been mounted on a user board. TAEC says that in recent years, the portable applications market has seen a trend toward small-scale, diversified production, which has
increased demand for microcontrollers with built-in Flash memory and performance comparable to their mask ROM counterparts. Samples are scheduled to be available in March 2003 and volume production is slated to begin in May 2003.


Xilinx Inc. announced a web-portal addition to the Xilinx eSP web portal to accelerate development of wireless applications. The portal provides resources for system designers and includes specific reference designs to IP resulting from collaboration in the areas of cellular networks, fixed broadband wireless, and wireless LANs. The site also provides wireless technology tutorials, market overviews, system block diagrams, glossaries, and a directory of wireless experts.


Also from Xilinx - The company and Jungo Software Technologies, Inc. announced that Xilinx will include a 30-day evaluation version of Jungo's driver development software - WinDriver, KernelDriver, and Hardware Debugger - in its Real-PCI 64/66 design kit. Jungo's driver development tools include graphical user mode development environments, APIs specific to Xilinx PCI technology-based cores, samples, and diagnostic and debug utilities for device driver development.




Coming soon to a theater near you


electronicChina - Held in conjunction with PCIM China's International Conference for Power Electronics, Intelligent Motion, and Power Quality, and SEMICON China - this is Messe München International's second annual international trade fair in Shanghai and showcases components, assembly, electronics production, and photonics technology. It will be taking place from March 12th to 14th at the Shanghai New International Expo Centre (SNIEC), and will include the electronicChina Forum addressing “Global Trends and Future Technological Challenges in Mobile Communication.” Last year's trade show attracted 284 exhibitors from 17 countries and had more than 15,000
attendees.


ISPC and GSPx - This is GTC's (Global Technology Conferences) first annual International Signal Processing Conference and Global Signal Processing Expo and will be running March 31st through April 3rd in Dallas, TX. Organizers say the event is “addressing the needs of the industry and academia for an event presenting signal processing enabled applications.” They report that 400 presentations have been selected from 560 submissions representing over 40 countries. And with an eye to the future, Conference Chair Dr. Amnon Aliphas says, “This venue offers a unique opportunity to prepare yourself for the economic rebound.”




Newsmakers


CoWare has named Dr. Heinrich Meyr as Chief Scientist reporting to CoWare President and CEO Alan Naumann. Dr Meyr, co-founder of LISATek Inc. - recently acquired by CoWare - has also been named to the CoWare Board of Directors and will lead its Technical Advisory Board. Currently, Meyr is head of the Institute for Integrated Signal Processing Systems (ISS) at the Aachen University of Technology in Germany. Previously, he founded CADIS GmbH and introduced COSSAP, a tool for the communications industry. CADIS was acquired in 1993 by Synopsys, Inc. Meyr has published numerous IEEE papers, is a Fellow of the IEEE, a recipient of the Vodafone Prize for contributions to wireless
communications, and holds several patents. Additionally, he has served as Vice President for International Affairs of the IEEE Communications Society. Meyr received an M.S. and Ph.D. from ETH in Zurich, Switzerland, and spent 12+ years in industry research and management positions before accepting a professorship in Electrical Engineering at RWTH Aachen in 1977.


« Previous Page 1 | 2 | 3 | 4 | 5  Next Page »


You can find the full EDACafe event calendar here.


To read more news, click here.



-- Peggy Aycinena, EDACafe.com Contributing Editor.


Rating:


Review Article Be the first to review this article
Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Diversity: Really, who cares
More Editorial  
Jobs
Senior Methodology Automation Engineer for EDA Careers at San Jose, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
DDR 3-4-5 Developer with VIP for EDA Careers at San Jose, CA
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Proposal Support Coordinator for Keystone Aerial Surveys at Philadelphia, PA
Upcoming Events
11th International Conference on Verification and Evaluation of Computer and Communication Systems at 1455 DeMaisonneuve W. EV05.139 Montreal Quebec Canada - Aug 24 - 25, 2017
The Rise of Mechatronics at Dassault Systèmes San Diego 5005 Wateridge Vista Drive San Diego CA - Sep 12, 2017
The Rise of Mechatronics at Buca di Beppo - Pasadena 80 West Green Street Pasadena CA - Sep 13, 2017
S2C: FPGA Base prototyping- Download white paper
TrueCircuits: IoTPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy