March 17, 2003
Division of Labor
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Oki Electric Industry Co., Ltd. and UMC announced today that a new ASIC product line will be introduced by Oki as a result of a business partnership between the two companies announced in September 2002. The new ASIC product line from Oki - the MG7xK family - uses UMC's 0.15-micron process technology.
QUALCOMM Inc. announced an agreement with Sun Microsystems, Inc. to develop and distribute Java 2 Platform, Micro Edition (J2ME Platform) virtual machine technologies. Support for J2ME will allow pre-existing Java applications to run on select QCT MSM chipsets, beginning with members of the 6xxx family of chipset solutions, and will have optimized performance through the use of the MSM's Launchpad suite of multimedia and other advanced technologies. Support for the Java runtime environment will also make QCT's chipsets compatible with other Java technology-compliant devices.
Teradyne, Inc. announced that the Haier IC Co. of Shanghai, a division of the Haier Group, selected Teradyne to assist in the design verification of a microcontroller for use in home appliances such as refrigerators, washers, air-conditioning units, and dish washers. The company says the selection was based on the results of a “competitive design-in” and on “Teradyne's strong applications and customer support infrastructure in China.”
Texas Instruments Inc. announced three new DSPs with performance characteristics clocked at 720 MHz. The company's previous DSP performance record was set at 600 MHz. The three DSPs are designed to increase multi-channel density, “multi-function flexibility,” and bandwidth. The devices are intended for digital video, imaging, and wireless/telecom infrastructure customers. The 720 MHz TMS320C6416, TMS320C6415 and TMS320C6414 DSPs are based on the TMS320C64x DSP core and produced on the company's 130-nanometer Cu-process technology. All three DSPs include 1 MB of on-chip high-speed memory.
Coming soon to a theater near you
Longmont, Los Angeles, Ottawa, Phoenix, Raleigh, San Diego, San Jose, and Toronto. The forum will also be held later, in other locations throughout the world - Munich on May 15th, Shanghai on June 16th, Hsinchu on June 18th, Seoul on June 20th, and Tokyo on June 24th. (
DAC 2003 - Of course, you already know you need to get to Anaheim in the first week of June to attend DAC 2003. Conference organizers have now announced that two stalwarts of the industry will give the keynotes. On June 5th, U.C. Berkeley's Dr. Alberto Sangiovanni-Vincentelli will address “The Tides of EDA” - his perspective on the cyclical behavior of the EDA industry, technology advances, and how the EDA and design communities need to collaborate to contribute toward the electronics industry's recovery. Maybe the industry will have recovered by June and he won't have to cover that last bit.
But first, on June 3rd, ARM's Sir Robin Saxby will present: “Less than 100 nanometers ... A Giant Leap for Mankind?” The question mark is probably the give-away here as Sir Saxby will be discussing what is undoubtedly a rhetorical question at best - whether or not the industry will be able to take advantage of all the additional transistors that will emerge from further pursuit of the holy grail of the semiconductor industry - Moore's Law. (
18th at the San Jose Convention Center. (
Pittsburgh Simulation Corp. announced the appointment of Roddy Beat as Director of European Operations, to set up European headquarters for the company. Plans include a system center with application engineering support in a European location to be announced soon. Previously, Beat was European sales manager for Cadence Design System's IMS group.
Tower Semiconductor announced that “longtime co-chief executives Dr. Yoav Nissan-Cohen and Dr. Rafi Levin have announced their intention to resign from service, after leading the company for 10 years and completing the main task of launching Fab 2 operations, the company's 0.18-micron and below manufacturing facility, which opened earlier this year.”
announced will go into effect beginning June 1, 2003.
In the category of ...
Personal notes from PCB West 2003
Early last week, the NASDAQ celebrated the 3-year anniversary of its peak valuation in March 2000 by reaching a point fully 75% below that peak - an unbelievable collapse in value that few can really comprehend.
I celebrated that same anniversary by going to PCB West 2003 going on all week at the San Jose Convention Center. It was being co-located for the first time with HDI Expo 2003 - both shows managed by the newly established UP Media Group. The show was definitely smaller and quieter this year compared to 2001 when I last attended, but that's not surprising given the economic and international challenges that abound.
Lots has changed since I last saw Pete Waddell, Founder and President of UP Media, and his team back in early 2001 - national tragedies, economic unraveling, and now a possible war. But good things have happened as well. UP Media was formed when Pete purchased the Atlanta “books” from CMP Media - PC FAB, Printed Circuit Design, and Circuits Assembly - along with the related shows.
Ronda Faries, formerly Editor-in-Chief of PCD, is now Marketing Development Manager for UP Media reporting directly to Pete. She says that, although the past year has definitely tested the young company, the staff is more streamlined these days, they're up and running, and they're meeting the challenges of the new business day-by-day. That was good to hear and Pete echoed Ronda's up-beat evaluation.
The keynote speaker at the show was Nic Brathwaite, CTO at Flextronics. He gave one of the best keynote addresses I've heard in a long time. Among other things, he dismissed high-tech “phraseology” - particularly the venerable concept of Time to Market. He said the term has become “absolutely meaningless,” and yet he hasn't seen a presentation in years that doesn't include the phrase. He said if people were serious about achieving Time to Market, they would pay closer attention to the communication disconnect between the design environment and the manufacturing environment.
Brathwaite made a compelling case for a more thoroughly integrated inter-company and intra-company collaboration process where parametric, geometric, and supply-chain information are all dynamically linked from the project get-go - where the supply chain is set-up in parallel with the design phase so that the procurement people have a “heads-up” as the design process moves to completion.
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-- Peggy Aycinena, EDACafe.com Contributing Editor.
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