September 06, 2004
Design for Manufacturability (DFM)
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yield greater than that created by simply meeting the design rules and guidelines.”
Joseph D. Sawicki, VP & GM of Mentor Graphics' Design-to-Silicon Division adds: “How do I define DFM? For one thing, it's not a noun--it's an adjective that means to extend and expand current design flows to optimize for manufacturing. DFM supposes that design matters and how functionality is put onto silicon positively or negatively effect the manufacturability of the design. DFM represents tools and processes that intelligently leverage extensive design rule expertise, account for the impact of parasitics on timing and power, and work to detect and pinpoint areas of concern, whether they be performance degradation or yield loss. It is a deepening of the connection between physical
verification, post-layout applications (such as OPC-optical and process correction), and design for test. DFM will give the designer the ability to conduct a cost/yield analysis on full chip data, optimally trading off size, performance and yield.”
The diagram below from MEDEA (Micro-Electronics Development for European Applications) shows the desired foreword and feedback paths for information exchange. Given the situation plus the exploding size of GDSII file it is not surprising that there are already efforts underway to define a more compressed and comprehensive data format.
Semiconductor Equipment and Materials International (SEMI) rolled out the Open Artwork System Interchange Standard (OASIS) in September 2002 as a replacement for the GDSII file format, and said it promises a tenfold reduction in design data compared to GDSII while improving the quality of information. OASIS is a specification for hierarchical integrated circuit mask layout data format for interchange between EDA software, IC mask writing tools and mask inspection tools. OASIS is an open, broadly applicable, interchange method and set of interrelated ideas and principles that define illustrative design data elements as geometric data. OASIS was approved by the SEMI worldwide lithography
committee in July 2003. In addition to file size reduction OASIS efficiently handles flat geometric data, including arrayed geometric figures; removes 16-bit and 32-bit restrictions, allowing integers to extend to 64 bits and beyond when required; and enhances overall information richness.
In June 2004 Mentor Graphics announced a free GDSII-to-OASIS translation utility available for download from its website.
What has been proposed is the development of a Unified Data Model (UDM), a common design-through-manufacturing data model. The Semiconductor Equipment and Materials International (SEMI) Universal Data Model working group had already endorsed the OpenAccess data model and API as the basis for a more intrinsic, comprehensive design chain data link between IC design and manufacturing. OpenAcess has been the main Si2 project providing an open standard and data API and reference database supporting that API for IC design. The DTMC will lead the OA-UDM industry project under Si2 to deliver the UDM with supporting technology.
Appendix on Lithography Future
According to the INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS (ITRS) 2003 EDITION on LITHOGRAPHY:
On August 10, 2004 Intel announced that it has achieved two milestones in its development of extreme ultraviolet (EUV) lithography, an emerging technology for making faster, more powerful computer chips. Intel has just installed the world's first commercial EUV lithography tool and established an EUV mask pilot line. The company says that the developments mark the move of the technology out of R&D phase and into a manufacturing environment. Intel plans to use the EUV approach at the 32-nm node, which goes into volume manufacturing in 2009.
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-- Jack Horgan, EDACafe.com Contributing Editor.
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