August 29, 2005
Power Integrity with Sigrity, Inc.
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Rambus and UMC Expand Availability of Rambus PCI Express PHY IP for a Broader Range of Process Technologies; Licensing Agreement Now Encompasses 180nm Down to 90nm Process Technologies
New SteelVine Storage Processor From Silicon Image Enables Affordable, High-Performance, Two-Drive 3Gb/s Sata Solutions
Elpida Memory Completes Development of Next-Generation 512 Megabit DDR3 SDRAM for High-Performance Computing; Newly Developed DRAM Device Offers Twice the Speed of DDR2, First to Utilize "Dual Gate" Transistor Technology
IDT Cuts PC Clock Generator Power by up to Fifty Percent; Leveraging Its Expertise in I/O Technology, IDT Significantly Lowers Power Consumption of Its PC Clock Devices to Bring Added Power Savings to Notebook Computers
MagnaChip Semiconductor S.A. and MagnaChip Semiconductor Finance Company Announce Extension of Exchange Offer
China Semiconductor Industry Association Signs Agreement to Base Standards on VSI Alliance Standards
Tropian(R) Launches Timestar(TM) TR15431N Multimode RF Transceiver; Supports GSM, GPRS and EDGE Standards in a Single Integrated Circuit
National Semiconductor's New Integrated Converters Feature Greater Than 90 Percent Efficiency Over a Wide Load Range
Infineon DRAM Technology Delivers Better Thermal Efficiency, Increased Performance in New Mobile Computing Platforms
FTTH Market Leader Passave Introduces Chip Set For GPON-Based Gigabit Access Networks; Passave Adds GPON to Its Gigabit FTTH Product Portfolio
UMC Achieves Record Milestone of Over 100,000 90nm Wafer Shipments; Accomplishment Marks Highest Wafer Volume Shipped by Any Foundry for 90nm Products
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-- Jack Horgan, EDACafe.com Contributing Editor.
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