September 19, 2005
Structured ASICs ala eASIC
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Cadence Unveils Next-Gen Verification System (Electronic News Magazine) Cadence Physical Verification System for rapid turnaround of DRC and LVS. The system's massively parallel approach facilitates multiple design turns per working day-even for the largest designs at 90-nanometers, 65-nanometers and below that would otherwise require overnight or multi-day runs.
Cadence Goes for Kits (Electronic News Magazine) The kits address application-specific design challenges by combining a verified methodology, packaged in platform flows, with IP and consulting all demonstrated on a representative reference design.
Cray and Celoxica Make Reconfigurable Computing Easier to Program by making Celoxica's DK Design Suite available to Cray customers who want to use a software design flow to accelerate their applications using FPGAs integrated into the Cray XD supercomputer. The DK Design Suite consists of C-based design and synthesis tools that allow software engineers skilled in high-level programming languages to implement FPGA-based algorithms using the familiar C language.
DATE presents a new initiative on System Design Records This initiative aims at presenting circuit and system design experiences that can prove to reach a record in terms of performance, power management, size, innovation in applications or that show any other concrete advantage with respect to state of the art applications.
Other EDA News
EMA Strengthens RoHS Compliance Design Methodology with the Integration of PTC InterComm; InterComm is a Powerful, Yet Simple Tool to Strengthen Design Collaboration And Review
Accelerated Technology Affirms Embedded Expertise with Release of Embedded Software Book Compiled by Seasoned Industry Developer
Synopsys Chairman and Chief Executive Officer to Speak at Bank of America Securities 35th Annual Investment Conference
ESL Design Targets Convergent DSP and FPGA; Joint Offering Combines Celoxica ESL Tools With Advanced DSP+FPGA Systems From Sundance in Complex Signal Processing Implementation
Accelerated Technology's Nucleus EDGE Becomes the First Commercial Embedded Software Solution to Fully Support Xilinx FPGA Processors
New Cadence Physical Verification System Changes Physical Verification Paradigm; Next-Generation Approach Dramatically Reduces Run Time, Improves Predictability and Produces Immediate Results
Cadence Delivers on First Milestone in Kits Strategy; Cadence Kits to Address Key Design Challenges in Wired, Wireless and Consumer Electronics Segments
ARM and Cadence Optimize Digital SoC Design Through Expanded Collaboration; Alliance Produces Methodology Kit to Improve Performance, Power, and Area for Synthesizable ARM Processors
New Cadence Product Segmentation and Technology Address Growth in Chip Complexity; Advanced Automatic Floorplanning Technology within Cadence Encounter Simplifies High End SoC Design
Other IP & SoC News
Gov't of Canada invests $7M in Tundra Semiconductor to develop Next-Generation RapidIO(R) technology
International Rectifier Introduces High Voltage Class D Audio Control IC That Protects and Simplifies Digital Amplifier Circuits
Philips Ramps 90-nm CMOS Products into High-Volume and Test-Chips Process Options; Philips Maximizes 90-nm CMOS Production at Crolles2
Zarlink First to Introduce Devices Carrying Timing and Synchronization over Packet Switched Networks
RFDomus Announces Pre-Production Sampling of Industry's Lowest Power RFIC for Global Positioning Systems
Faraday Selects Semiconductor IP from SafeNet to Power Secured Server Control Chip; SafeNet's SafeXcel IP Enables Next-Generation Command Center Appliances
Accton Offers Industry's 1st Single-Chip 48-Port Gigabit+ Switch Solution, Kicking-off New High-Performance, Efficient, Economical, High-Density Gig+ Switch Family
Texas Instruments and MangoDSP Announce New Low-Cost Solution for Advanced Video Surveillance Applications
K-Micro Adds SonicsMX Technology to its SoC IP Portfolio; Rapid Turnkey, Low-Power Wireless and Digital Consumer ASICs Simplified with Sonics' Technology
2005 FSA Suppliers Expo and Conference Features New Supplier Tracks; Vinay Asgekar of QUALCOMM CDMA Technologies To Deliver First Day Keynote
Flextronics Completes the Sales of Flextronics Semiconductor and 70% of Flextronics Network Services
Atmel's SecureAVR Microcontroller Awarded Common Criteria EAL4+ Certification for Healthcare and Banking Applications
Spansion Introduces Innovative Package-on-Package Solution to Reduce Wireless Device Size; Spansion's Solution Reduces Form Factors as Devices Adopt New Features
Renesas Technology Introduces SuperH(R) Microprocessor That Supports Gigabit Ethernet for Network Devices and Digital Home Appliances
Intersil Introduces Industry's Most Accurate Multiphase Core Controller with Thermal Monitoring and Temperature Tracking Over-Current Protection
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-- Jack Horgan, EDACafe.com Contributing Editor.
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