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July 12, 2012 -- Minneapolis, MN - The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida. The hands-on PoP Center will be located right on the exhibition show floor, Tuesday and Wednesday, during the electronics exhibition. Attendees can see the process first hand including placement of PoP, in process inspection of package assemblies, application of dip paste and dip flux, rework of PoP and inspection, and PoP process defects, causes and cures. Attendees are encouraged to bring samples and technical challenges to examine at the event.
A free webinar providing a basic introduction to Package on Package technology will be conducted by Bob Willis, well known SMTA instructor and creator of the first PoP inspection and training resources, on Tuesday, September 11th at 11:30am Eastern Time. Interested parties can register online. ( https://www2.gotomeeting.com/register/485844538 )
Daily seminars will provide a more in-depth look at various issues and challenges of PoP technology. Attendees will receive the slides and access to a video library of each of the presentations. Seminar topics include Design Guidelines for PoP, Assembly Process Challenges with PoP, Inspection Guidelines for Package on Package, and How to Rework POP Assemblies with Confidence.
Current participants include Bare Board Group, Martin Finetech, Nordson DAGE, Tropical Stencil, Senju Comtek, Indium Corporation and Chase Components. Questions or problems can be sent before the show to email@example.com. The issue will be analyzed and an appointment set up to pinpoint the cause and develop a solution.
Details about SMTA International can be found online at http://smta.org/smtai or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or firstname.lastname@example.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.