Toshiba Announces Space-Saving 6-Pin Photocoupler Optimally Suited for Direct Gate Driving of IGBTs and Power MOSFETs
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Toshiba Announces Space-Saving 6-Pin Photocoupler Optimally Suited for Direct Gate Driving of IGBTs and Power MOSFETs

New IC Photocoupler in 6-Pin SDIP Package Meets Requirements for Insulation Requirements of International Safety Standards

IRVINE, Calif., June 3 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, announced the TLP700, a new IGBT/MOSFET driver photocoupler with Photo-IC output that features a peak output current of +/-2.0A (max.), a 2mA (max.) supply current, which keeps heat generation to a minimum, and a high isolation voltage of 5000V(rms).

The TLP700, housed in a 6-pin SDIP (Shrink Dual Inline Package), is capable of reducing the surface mounting area by approximately 50 percent compared to a photocoupler in an 8-pin DIP (Dual Inline Package) while achieving equivalent isolation characteristics. Optimally suited for direct gate driving of low power IGBTs or power MOSFETs, the new IC photocoupler is targeted for a wide range of applications, such as factory automation (FA) equipment, robots, general-purpose inverters, inverter air conditioners, AC servo motor control and IGBT/MOSFET drives.

Developed by Toshiba Corp. (Toshiba), the TLP700 is the latest in a family of IGBT/MOSFET driver photocouplers that include the TLP250, TPL251, TPL350 and TPL351. Each of the four earlier devices are offered in 8-pin DIP. The TLP700 is functionally equivalent to the existing Toshiba TLP350 photocoupler, in a smaller package, and meets insulation requirements for UL and EN60747-5-2 international safety standards (1).

"TLP700 is intended to meet application requirements for IGBT and power MOSFET drivers in which low power consumption and high isolation voltage, for safety concerns, are important factors," said Jay Heinecke, business development director, Discrete Business Unit, for TAEC.

The new photocoupler consists of an integrated photodetector optically coupled to a gallium-aluminum-arsenide light-emitting diode in 6-pin SDIP package that measure only 6.8mm x 7.62mm x 3.65mm high. The standard 7.62-mm pitch type TLP700 features 7.0 mm (min.) creepage distance and clearance. The performance is guaranteed over operating temperature (T(opr)) from -40 degrees C to 100 degrees C.

    TLP700 Technical Specifications

      Characteristic                Symbol       Typical Rating

    Peak output current          I(OPH)/I(opl)   +/-2.0 A (max.)

    Supply current               I(CCH)/I(CCL)   2 mA (max.)

    Power supply voltage            V(CC)        15~30V

    Input threshold current         I(FLH)       5 mA (max.)

    Propagation delay time       t(pLH)/t(pLH)   500 ns (max.)

    Isolation voltage               BV(S)        5000 V(RMS) (min.)

    Common mode transient
     immunity                    CM(L)/CM(H)     +/-10 kV/micro seconds (min.)

    Pricing and Availability
    Samples of the TLP700 photocoupler with 6-lead SDIP package are available

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2007 Worldwide Semiconductor Market Share Report," Gartner, released April 2008). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks, LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue Ranking, April 2008). For additional company and product information, please visit

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at, or from your TAEC representative.

    (1) UL recognized: UL1577, file No. E67349
        Option (D4) type TUV approved: DIN EN60747-5-2, Certificate No.
        Note:  When an EN60747-5-2 approved type is needed, please designate

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