eSilicon CEO Jack Harding to Speak on IP Issues at 2008 Semico Summit

—(BUSINESS WIRE)—March 11, 2008— eSilicon Corporation:
WHAT:   eSilicon Corporation's President, Chairman and CEO, Jack
         Harding, will participate on a panel at the annual Semico
         Summit put on by semiconductor market research firm Semico.
         The 2008 Summit is themed "Technology for the Masses" and
         features a variety of executive-level speakers from the
         semiconductor and consumer electronics industries.

        Mr. Harding will sit on a panel entitled "Where is The IP
         Market Going," which will examine the current state and
         future sustainability of the semiconductor intellectual
         property industry. He will be joined on the panel by Simon
         Segars, Executive Vice President and General Manager at ARM,
         and Ted Vucurevich, Senior Vice President, Chief Technology
         Officer at Cadence Design Systems.

        For more information on the Semico Summit, go to:
        http://www.semico.com/eventsummit/summit.asp

WHEN:   March 16-18, 2008
        IP Panel is Monday, March 17 at 2:00PM

WHERE:  Camelback Resort & Spa in Scottsdale, Arizona

WHO:    eSilicon, an industry-leading Value Chain Producer (VCP) for
         the semiconductor industry, provides a comprehensive suite
         of design, productization and manufacturing services,
         enabling a flexible, low-cost, lower-risk path to volume
         production. The company delivers chips to system OEMs and
         fabless semiconductor companies who serve a wide variety of
         markets including the consumer, computer, communications and
         industrial segments. For more information, visit
         
www.esilicon.com 


eSilicon is a registered trademark of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contact:

eSilicon Corp., Sunnyvale, Calif.
Dmitry Lipkin, 408-616-4655
Email Contact
or
Wired Island PR
Mike Sottak, 408-876-4418
Email Contact




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