ZTE Selects Mindspeed(R)'s DS3/E3 Line Card-on-a-Chip Solution for 3G Wireless Platforms

NEWPORT BEACH, Calif.—(BUSINESS WIRE)—July 2, 2007— Mindspeed Technologies, Inc. (NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that ZTE Corporation, a leading global provider of telecommunications equipment and network solutions, has selected Mindspeed's two-port DS3/E3 line card-on-a-chip (LoC) for use in ZTE's Core Network (CN) and Radio Network Controller (RNC) of W-CDMA 3G wireless backhaul platforms. The M29312 LoC integrates two independent DS3/E3 line interface units (LIUs) with framers, ATM/HDLC processors, and telecom application package (TAP) driver software.

The CN and RNC platforms are key elements of ZTE's comprehensive 3G mobile communication solution.

"Mindspeed's two-port LoC is a flexible, cost effective solution that enabled us to develop similar designs for both our CN and RNC systems," said Mr. Fan Ronghu, the HW Director of ZTE.

"Mindspeed is proud to be part of ZTE's worldwide 3G deployment with our highly integrated LoC family," said Rammy Bahalul, Director of Marketing for Mindspeed. "Our best in class ATM and IP products continue to play a major role in the 3G and 4G wireless backhaul deployment."

The M29312 is an ultra low-power, two-port highly integrated DS3/E3 LoC optimized for low-port density and power-sensitive datacom applications, such as wireless backhaul, routers and digital loop carrier equipment. Mindspeed's comprehensive family of DS3/E3 LoCs provides the industry's most highly integrated solutions ranging from one to 12-ports.

About ZTE

ZTE is a leading global provider of telecommunications equipment and network solutions. The ZTE product range is the most complete in the world - covering virtually every sector of the wireline, wireless and handset markets. The company delivers innovative, custom-made products and services to customers in more than 100 countries, helping them to achieve continued revenue growth and to shape the future of the world's communications. ZTE commits around 10% of annual turnover to research and development and takes a leading role in a wide range of international bodies developing emerging telecoms standards. It is the fastest growing telecoms equipment company in the world, and is China's only listed telecoms manufacturer, with shares publicly traded on both the Hong Kong and Shenzhen Stock Exchanges. ZTE was the only Chinese IT and telecoms manufacturer listed in BusinessWeek 2005's Information Technology 100 and was included in its 2006 ranking of China's Top 20 brands. www.zte.com.cn

About Mindspeed Technologies(R)

Mindspeed Technologies, Inc. designs, develops and sells semiconductor networking solutions for communications applications in enterprise, access, metropolitan and wide area networks.

The company's three key product families include high-performance analog transmission and switching solutions, multiservice access products designed to support voice and data services across wireline and wireless networks, and WAN communications solutions including T/E carrier physical-layer and link-layer devices, as well as ATM/MPLS network processors.

Mindspeed's products are used in a wide variety of network infrastructure equipment including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers and digital loop carrier equipment.

To learn more, visit us at www.mindspeed.com.

Safe Harbor Statement

This press release contains statements relating to Mindspeed, and our future results, including certain projections and business trends, that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results, and actual events that occur, may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: market demand for our new and existing products and our ability to increase our revenues; our ability to maintain operating expenses within anticipated levels; our ability to reduce our cash consumption; availability and terms of capital needed for our business; constraints in the supply of wafers and other product components from our third-party manufacturers; our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; the ability to attract and retain qualified personnel; successful development and introduction of new products; our ability to obtain design wins and develop revenues from them; pricing pressures and other competitive factors; order and shipment uncertainty; changes in our customers' inventory levels and inventory management practices; fluctuations in manufacturing yields; product defects; and intellectual property infringement claims by others and the ability to protect our intellectual property, as well as other risks and uncertainties, including those detailed from time to time in our Securities and Exchange Commission filings.

Contact:

Mindspeed Technologies, Inc.
Editorial Contact:
Tom Stites, 949-579-3650
or
Investor Relations Contact:
Simon Biddiscombe, 949-579-6283




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