SoftMax 1VOICE Noise Cancellation Software Enables Greater Audio Quality for Bluetooth Headsets Based on Broadcom's BCM2047 Platform
The increasing adoption of Bluetooth technology in mobile phones is driving unprecedented demand for high quality Bluetooth headsets. To capitalize upon this growth, OEMs are looking for ways to differentiate their Bluetooth headsets with better audio quality. By adding SoftMax's signal separation technology to Broadcom's highly-integrated BCM2047 architecture, manufacturers can design sleek form factors that perform well in almost any noise environment.
Compared to competing silicon products that use proprietary processor technologies and require custom software development, Broadcom's new ARM-based BCM2047 provides a familiar environment to speed software development. This rapid development provides Broadcom's customers with a variety of ways to differentiate their products without adding significant cost and development time to their design cycles.
"We are very excited to offer our 1VOICE Noise Reduction technology on the Broadcom BCM2047 platform," said Sheldon Gilbert, Vice President of Business Development for SoftMax, Inc. "By leveraging Broadcom's ARM-based development approach, we quickly ported our software to its new Bluetooth headset solution, allowing OEMs to deliver products with superior performance right away. Also, the efficient ARM-based architecture was an excellent match for our technology, resulting in world class noise reduction performance in a very small MIPS(R) and battery-power footprint."
"SoftMax's 1VOICE Dual Mic Noise Reduction technology will complement the high-quality features of our new Bluetooth headset solutions to provide an exceptional audio experience for wireless headset users," said Seow Lim, Director of Marketing for Broadcom's Bluetooth line of business. "Our BCM2047 design approach enables software partners, such as SoftMax, to add valuable features and accelerate time-to-market for our headset customers."
The new Broadcom BCM2047 single-chip Bluetooth headset solution provides an advanced silicon and software platform that significantly improves the user experience of wireless mono and stereo headsets. Based on Broadcom's field-proven Bluetooth technology, the audio platform supports Bluetooth Version 2.0 with enhanced data rate (EDR) technology and is upgradeable to Bluetooth Version 2.1. Integrating the world's most mature and highest performance radio technology, the BCM2047 features a power-efficient architecture that extends talk and standby time while enabling the use of a smaller battery.
SoftMax's 1VOICE Noise Reduction technology is based on a proprietary signal separation platform that uses sophisticated adaptive statistical techniques to separate voice signals from any background noise. This is achieved by extracting the individual components from the mixture of audio captured by the user's device making it very effective against all types of noise whether stationary, such as road noise, or non-stationary, such as music or other human voices. SoftMax technology provides superior noise reduction performance in one of the smallest MIPS and memory footprints. In addition to noise reduction, the SoftMax 1VOICE solution on the BCM2047 provides a complete audio enhancement package including echo cancellation and automatic volume control.
SoftMax, Inc. is the market leader of 2-microphone noise reduction solutions for Bluetooth headsets, mobile phones and other electronic audio platforms. SoftMax is a privately held company headquartered in San Diego, California. For more information, visit the company's Web site at http://www.softmax.com.
Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything.
Broadcom is one of the world's largest fabless semiconductor companies, with 2006 revenue of $3.67 billion, and holds over 2,000 U.S. and 800 foreign patents, more than 6,000 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data.
Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at http://www.broadcom.com.
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Important factors that may cause such a difference for Broadcom in connection with its BCM2047 products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for Bluetooth headset applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost- effective and timely manner; intellectual property disputes and customer indemnification claims and other types of litigation risk; the quality of our products and any remediation costs; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; the risks and uncertainties associated with our international operations; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effectiveness of our expense and product cost control and reduction efforts; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.