Broadcom Showcases World's Most Advanced 65 Nanometer Single-Chip Mobile Solutions at 3GSM World Congress

Combination of the Industry's Broadest Communications IP Technology Portfolio, Plus 65nm Manufacturing Processes, Equates to Revolutionary New Mobile Solutions

BARCELONA, Spain, Feb. 12 /PRNewswire-FirstCall/ -- 3GSM World Congress - Broadcom Corporation (NASDAQ: BRCM), a global leader in semiconductors for wired and wireless communications, is showcasing new 65 nanometer products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain. With the industry's broadest communications IP technology portfolio, coupled with new 65nm technologies, the demonstrations at 3GSM illustrate how Broadcom has squeezed a greater number of robust features within smaller board spaces and slimmer mobile handset designs. Featuring the industry's highest integration, lowest power consumption, smallest size and lowest bill of materials (BOM) available, Broadcom's new 65nm mobile and wireless products are all available today.

The 65 nanometer process is the most advanced lithographic node for manufacturing semiconductors in large volumes today and provides significant benefits over 90nm and 130nm processes by enabling lower power consumption, smaller size, higher yields and higher levels of integration. For Broadcom, the move to 65 nanometer process technology is changing the competitive landscape because of the breadth and depth of the communications intellectual property the company possesses. Without a broad portfolio of market-leading solutions to integrate, competitors are not able to take full advantage of the benefits that these next-generation processes provide. Broadcom's vast communications intellectual property for transporting voice, video and data at home, work and on-the-go are helping to enable customers and service providers with a truly seamless communications experience for end users worldwide.

"Broadcom is making good on our promise to deliver the most advanced solutions for tomorrow's converged mobile devices, enabling us to establish a leadership position in new markets, as well as strengthening our positions where we already have dominance," said Vahid Manian, Senior Vice President of Broadcom's Global Manufacturing Operations. "At 3GSM, we are demonstrating available 65 nanometer solutions that build upon our track record of superior technical innovation while facilitating the next step in wireless convergence with unprecedented levels of integration."

Portable mobile device manufacturers and service providers are working aggressively to launch next-generation products and services utilizing Broadcom(R) advanced 3G and 2G cellular and related connectivity solutions. At this week's 3GSM World Congress, Broadcom will demonstrate a CMOS EDGE radio, advanced HSDPA baseband processor chips, an ultra low power EDGE processor that integrates the radio and helps extend battery-life, and a multi-function connectivity solution that combines Wi-Fi(R), Bluetooth(R) and FM receiver technologies onto a single silicon die. With these advancements, Broadcom's 65 nanometer solutions enable such cutting-edge features as mobile TV, high-speed Internet access, MP3 support, PVR video playback, camcorder capabilities, and more.

The desire to bring all of this functionality within a single, compact- size device with longer battery-life, is helping to guide Broadcom's R&D investments from a product and intellectual property perspective. With a diverse communications portfolio from its Broadband Communications, Enterprise Networking and Mobile & Wireless Groups, Broadcom is accelerating next- generation 65nm processes to produce a family of solutions that no other silicon vendor is able to provide.

Over the past month, Broadcom has introduced a variety of 65nm system-on- a-chip (SoC) solutions well in advance of competitive rivals. Many semiconductor vendors depend on their foundries and fabrication houses to transition from one geometry process to another, which includes re-tooling design libraries to the advanced process. On the other hand, Broadcom completed these efforts internally, resulting in a much faster time-to-market and an opportunity to drive widespread adoption of 65nm solutions. As a further competitive differentiator, 65 nanometer solutions developed by Broadcom can be produced by a number of qualified foundries providing manufacturing flexibility while eliminating single-source dependence.

Highlighting the company's position as a cellular technology innovator for advanced mobile devices, the following 65 nanometer products are now available and will be demonstrated at 3GSM:

    - 65 Nanometer BCM21331 Single-Chip EDGE Processor:
      Broadcom's new BCM21331 EDGE processor combines the key components
      needed for advanced multimedia phones on a single monolithic chip.
      Designed in a 65 nanometer CMOS process, the new EDGE processor fully
      integrates an EDGE radio frequency (RF) transceiver, all of the analog
      and digital baseband functions, and enhanced multimedia support.  It
      accommodates small board spaces and slim designs and features the
      highest integration, lowest power consumption and lowest bill of
      materials (BOM) available.  This EDGE processor provides a new level of
      affordability for the largest segment of the handset market.

    - 65 Nanometer BCM2153 HSDPA Processor
      The BCM2153 is the industry's first solution for mobile handsets that
      integrates a High-Speed Downlink Packet Access (HSDPA) baseband modem
      with a world-class multimedia processor on a single monolithic chip.
      The new mixed-signal device is the first developed in a 65 nanometer
      CMOS process and integrates a complete Category 8 HSDPA modem that
      delivers 7.2 Mbps of third generation (3G) connectivity for advanced
      applications.  With this level of integration, the new HSDPA processor
      requires less board space, costs less and consumes less power than
      competing two-chip solutions, enabling high-end 3G phones at 2G prices.

    - 65 Nanometer BCM2085 EDGE Transceiver:
      The BCM2085 is the industry's first 65 nanometer EDGE RF transceiver
      designed in pure digital CMOS.  It integrates all transceiver and analog
      baseband functionality to deliver unparalleled savings in power
      consumption, size and cost.  Combining low power (which helps extend
      battery-life), high integration and low cost, the BCM2085 is compatible
      with the most popular cellular basebands and reduces the RF board area
      by more than 50 percent for EDGE-based mobile handsets and other
      handheld devices.

    - 65 Nanometer BCM4325 Wi-Fi/Bluetooth/FM Receiver:
      The BCM4325 is the industry's most advanced single-chip connectivity
      solution that combines the company's market-leading Wi-Fi, Bluetooth and
      FM receiver technologies onto a single silicon die.  This combination of
      popular radio capabilities in a new ultra low power 65 nanometer CMOS
      system-on-a-chip allows OEMs to provide the richest connectivity
      features without a prohibitive impact on product cost, size or battery-
      life.  No other silicon provider can match Broadcom's positions in both
      the Bluetooth and Wi-Fi markets, or offer the low power benefits enabled
      by the advanced 65nm process.

In addition to these new 65nm products, Broadcom has also delivered the BCM3563 1080p digital TV SoC at this year's 2007 International CES in Las Vegas. The BCM3563 is the industry's first high definition (HD) digital TV silicon solution that supports full 1080p display resolution. Designed in 65 nanometer process, this new "television-on-a-chip" enables TV and other consumer equipment manufacturers to cost-effectively build TVs and displays with the industry's highest quality HD resolution. The new device is compatible with the National Television Systems Committee (NTSC) analog standard, the North American digital terrestrial or Advanced Television Committee (ATSC) digital standard and the digital cable television standard. In addition, the new chip supports picture-in-picture (PIP) and picture-by- picture display modes.

Broadcom is a major technology innovator in the global communications industry, with over 1,950 issued U.S. and 750 issued foreign patents, over 5,900 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data. The company continues to demonstrate its uncanny ability to be first to market with single-chip 65 nanometer solutions that include the advanced features that customers demand, at price- points that will enable mainstream adoption of compelling consumer electronic devices. Broadcom continues to assert its leadership in the wireless and mobile platform space with an ongoing Connecting everything(R) mission and expects to announce more 65 nanometer solutions throughout the year.

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