Broadcom Aims at the Single Largest Communications Semiconductor TAM with World-Leading Technology
Designed in 65 nanometer CMOS process technology, the new Broadcom(R) EDGE processor integrates an EDGE RF transceiver, all of the analog and digital baseband functions, and high performance multimedia and connectivity support. The new single-chip solution accommodates small board space and slim designs that require the highest integration, lowest power consumption and lowest bill of materials (BOM) available.
Consumers increasingly show a strong preference for feature-rich phones that provide advanced multimedia and messaging functionality beyond traditional voice communications. With EDGE technology deployments having achieved near ubiquity, appearing in over 250 networks worldwide, the wireless infrastructure now exists to support these advanced features and services. Previously, delivering affordable handsets that could take advantage of multimedia and high-speed connectivity has been a challenge, with multi-chip solutions adding to cost, power consumption and design complexity.
To address this opportunity, Broadcom today announced the BCM21331 single-chip EDGE multimedia processor. The BCM21331 processor provides the industry's highest level of radio frequency, mixed-signal, digital and analog technology integration, coupled with the lowest power consumption and smallest form factor available, all made possible through use of the low cost 65nm process. With a rich feature set and integrated RF circuitry that eliminates the need for an additional radio component, the BCM21331 EDGE processor is optimized for the fastest growing multimedia handset segment. The chip enables handset manufacturers to introduce a tiered line of EDGE mobile phones based on one solution, from very low cost, high volume handsets all the way through feature-rich multimedia phones.
"Consumers today demand fashionable phones with MP3 players, cameras and advanced video, but are unwilling to pay a significant premium for these capabilities," said Yossi Cohen, Senior Vice President and General Manager of Broadcom's Mobile Platforms Group. "Broadcom is first-to-market with a single- chip 65nm EDGE solution that introduces a new level of EDGE handset affordability, and also delivers rich multimedia, blazing fast connectivity and long battery-life. Through amazing engineering execution, we were able to leapfrog our competition, and can now enable our partners to meet the most demanding consumer challenges of tomorrow."
"This new integrated solution sampling this month demonstrates the product evolution that can be achieved through the kind of extreme integration that has driven Broadcom's success in several wireless markets," said Allen Nogee, Principal Analyst, Wireless Technology for In-Stat. "The size, cost, performance and power consumption of Broadcom's 65nm EDGE implementation will give handset makers a compelling solution for delivering cost-effective multimedia features across their entire product line."
The BCM21331 is the fourth generation of Broadcom's EDGE platform (which has been in production for over three years and is qualified with cellular operators worldwide, making it one of the most mature and stable in the industry). The integrated RF transceiver design benefits from Broadcom's extensive experience in pure digital CMOS radio design, delivering the highest RF performance and lowest power consumption available, and incorporates the recently announced Broadcom BCM2085 EDGE radio solution. With a deep intellectual property portfolio and mature, field-proven RF technologies (having shipped hundreds of millions of devices that include radio functionality), Broadcom is well suited to apply its expertise to the cellular RF market.
The BCM21331 processor is designed to enable cost-effective, rich multimedia functionality without additional components, providing on-chip support for the following popular features:
-- High quality cameras up to 3.2 megapixels, video streaming and capture up to 30fps at QVGA resolution using an advanced H.264 hardware accelerator that provides up to 3x higher performance than MPEG4 or H.263 solutions. -- Fully integrated audio support for separately driving an ear piece, speakerphone and stereo headset for music and video playback, eliminating the need for an external audio processor chip. -- Rapid transfer of multimedia files to and from the handset via an integrated USB 2.0 high-speed (480 Mbps) port with integrated PHY functionality and on-the-go support. -- Broadcom's proprietary M-Stream technology, and advanced single antenna interference cancellation (SAIC) signal processing, designed to improve cellular handset reception and voice quality, ultimately resulting in fewer dropped calls.
Broadcom also offers an array of optional devices that complement the BCM21331 to provide a complete handset solution: the BCM59001 power management unit; a choice among Broadcom's market-leading Bluetooth(R) solutions, including the BCM2045, BCM2048 Bluetooth + FM, or BCM4325 Bluetooth + Wi-Fi(R) + FM single-chip devices and Bluetooth software. Broadcom's CellAirity(TM) software suite, which includes pre-ported applications supporting an EDGE- class multimedia handset, enables OEMs to rapidly bring new mobile phones to market. CellAirity 2.0 software includes advanced multimedia and messaging applications, web browsing, Java games and rich connectivity options.
Broadcom is a major technology innovator in the global communications industry, with over 1,950 issued U.S. and 750 issued foreign patents, over 5,900 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data.
The BCM21331 is currently being demonstrated at 3GSM World Congress in Barcelona, Spain, and samples are available to early access customers. Broadcom's CellAirity software, Bluetooth software, Bluetooth devices, and PMU devices are all shipping in production.
Broadcom 3GSM Press Conference
Broadcom will host an exclusive press conference for media and analysts in conjunction with the 3GSM World Congress 2007 in Barcelona, Spain on Monday, February 12th, from 10:30 to 11:30 am CET. The press conference will include comments and insight from Broadcom's President and CEO, Scott McGregor, along with other Broadcom executives, as they introduce new technologies and products that showcase Broadcom's mobile technology leadership. To register for the press conference (media and analysts only) please contact Email Contact.
The live press conference will be made available to the public via audio webcast. To listen to the webcast, visit the Broadcom website at http://www.broadcom.com/investors. The webcast will be recorded and available until 5:00 p.m. Pacific Time on Wednesday, February 28, 2007.
Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of- the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).
Broadcom, one of the world's largest fabless semiconductor companies with unaudited annual 2006 revenue of $3.67 billion, is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-926-5000 or at www.broadcom.com.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement. Important factors that may cause such a difference for Broadcom in connection with the BCM21331 GPRS/EDGE cellular processor products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for cellular applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost- effective and timely manner; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.