Broadcom Announces a Complete Portfolio of New Solutions for Bluetooth(R) Wireless Headsets

Broadcom's Leading Bluetooth Technology Delivers an All New Headset Experience Featuring Unparalleled Audio Performance

IRVINE, Calif., Jan. 29 /PRNewswire-FirstCall/ -- Broadcom Corporation (NASDAQ: BRCM), a global leader in semiconductors for wired and wireless communications, today announced a new advanced silicon and software platform that significantly improves the user experience of wireless mono and stereo headsets. Based on Broadcom's field-proven Bluetooth(R) technology, the audio portfolio features two new single-chip solutions that support Bluetooth Version 2.0 with EDR (upgradeable to Bluetooth Version 2.1) and Broadcom's innovative SmartAudio(TM) sound enhancement technology. Targeting the greater than 80 million unit Bluetooth headset market(1), the new Broadcom(R) solutions enables the development of complete lines of high- and low-end headsets with sleek form factors, longer battery life and an improved audio experience.

"This new product targets the second largest application in the Bluetooth market and it provides an opportunity to drive further growth within this segment," said Celeste Crystal, Senior Research Analyst, Semiconductors at IDC. "As Bluetooth headsets continue to grow in popularity, form factor and sound quality will continue to convince consumers of the benefits of the wireless hands-free experience."

Previously existing Bluetooth headset silicon solutions suffered from inconsistent radio performance and inadequate power management, as well as excessive external circuitry and bulky batteries, while providing a disappointing audio experience (unless supplemented with complex and expensive external components). These limitations often resulted in unsatisfying headset size, weight, style and sound quality.

To address these shortcomings, Broadcom today announced its all-new Bluetooth audio portfolio that features two new chips optimized for high-end and basic headsets (the BCM2047 and BCM2044), its new SmartAudio voice clarity technology, and a specially tuned version of Broadcom's BTE Bluetooth software. Broadcom's mature Bluetooth technology has shipped in hundreds of millions of units and includes the highest performing radio and baseband technology, which resists interference from other devices and "blocking" by the human body that results in degraded radio performance. The power-efficient architecture extends talk and standby time and features many levels of software programmability with an ARM(R) architecture and tools to enable unique features for product differentiation.

"To achieve this breakthrough in audio clarity and quality, we've leveraged unique technologies from our deep communications portfolio, which, coupled with our considerable expertise in Bluetooth, has resulted in a powerful new platform that addresses existing audio headset deficiencies," said Scott Bibaud, Vice President and General Manager of Broadcom's Wireless Personal Area Networking line of business. "By enabling smaller form factors, longer battery-life and significantly improved audio performance with the most cost effective bill of materials, Broadcom is enabling breakthrough wireless headsets and audio products."

DSP-Enhanced Solution for Premium Sound Quality

Broadcom's BCM2047 includes the industry's most powerful multi-core architecture for Bluetooth audio products enabling premium headset products. This device features unparalleled integration to achieve a truly single-chip headset, featuring an integrated digital signal processor (DSP) for premium sound quality. The audio processing capabilities of the BCM2047 are powered by an ARM(R) AudioDE(TM) data engine - a high-performance, industry standard DSP. With sufficient performance to easily handle stereo and audio, compression algorithms (i.e. SBC, MP3 and AAC), the DSP architecture is optimized for Broadcom's SmartAudio technology to achieve superior voice quality delivering a superior user experience for headset prodcuts.

Cost-Optimized ROM-Based Alternative

For basic audio headsets that don't require extensive feature programmability, the BCM2044 is an ideal choice. This ROM-based, single-chip Bluetooth device includes many of the benefits of the BCM2047 at significantly lower cost. Featuring the same low-power Bluetooth radio and high quality audio architecture as the BCM2047, the BCM2044 also integrates a full feature power management unit including comprehensive safety circuitry. The BCM2044 enables low cost headsets with the same range and power management capabilities as those based on the BCM2047, with no compromise in audio quality.

SmartAudio Voice Enhancement Technology

Broadcom's new audio platform features SmartAudio technology, a proprietary sound and voice enhancement technology that provides breakthrough performance, significantly improves audio quality in noisy environments by reducing background noise by 95%, and enables unique form factor designs with minimal unwanted acoustic echo. The platform also includes Broadcom's new BTE Audio software stack optimized for audio applications. Because the BTE Audio stack is derived from the widely used BTE-Mobile and BTW stacks in mobile phones and PCs, interoperability with Bluetooth audio sources is well proven and widely tested for interoperability. Broadcom also offers the easy to use BTE Insight Tool for Audio Software Development Environment, allowing customers to get to market quickly with added differentiation. The software features portability between the BCM2047 and BCM2044 chips, enabling developers to leverage software development across different products.

Availability and Pricing

Broadcom's new audio portfolio is now sampling to early access customers. The new platform also features development kits and reference designs. Demonstrations of the technology were held at the recent CES show and will appear at the upcoming 3GSM World Congress.

About Broadcom

Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of- the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).

Broadcom, one of the world's largest fabless semiconductor companies with annual 2005 revenue of $2.67 billion, is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-926-5000 or at

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with Bluetooth products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for wireless networking applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

1 | 2  Next Page »

Review Article Be the first to review this article
CST Webinar Series


Featured Video
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Electronics Firmware / Digital DesignEngineer 2 for Northrop Grumman at Rolling Meadows,, IL
Upcoming Events
SEMICON Europe at Grenoble France - Oct 25 - 27, 2016
ARM TechCon 2016 at Santa Clara Convention Center Santa Clara CA - Oct 25 - 27, 2016
Call For Proposals Now Open! at Santa Clara Convention Center, Santa Clara, CA California CA - Oct 25 - 27, 2016
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy