Latest Generation of Broadcom's Intensi-fi(TM) Draft-802.11n Technology Provides Enhanced Wireless Performance in Select Lenovo Notebook Computers
In both internal and third party testing, current generation Intensi-fi technology (which includes the latest version software driver) was shown to achieve greater than 120 Megabits per second (Mb/s) of throughput at a separation of one room (30 feet) in a qualified test house with "real-world" radio interference present. In addition, the latest software was shown to deliver over 25 Mb/s of throughput at a point in the test house where 802.11g products failed to achieve a connection. The new Broadcom drivers were also shown to interoperate with products based on competing chipsets at speeds greater than 100Mb/s. Users of the select Lenovo notebooks will enjoy more reliable access to the Internet compared to earlier draft-N products as well as several times the throughput of prior generations of 802.11g Wi-Fi solutions.
The WLAN solution in the select Lenovo models is dual band, meaning it operates in either the 2.4GHz or 5GHz frequency band. This gives users the greatest flexibility in connecting to home or corporate networks. The cards are backward compatible to both 802.11a and to 802.11g, ensuring that they will interoperate with millions of installed access points.
"Lenovo continues to offer the most advanced wireless technologies available on its cutting edge notebook computers," said Brian Bedrosian, Director of Marketing for Broadcom's WLAN line of business. "Users, especially small business owners, require a combination of portability and performance from their technology investments. By using Broadcom's Intensi-fi(TM) draft-802.11n technology, these notebook computers from Lenovo will ensure a superior wireless experience today as well as accommodating future networking demands."
The Lenovo 3000 notebooks are designed for mobile small business professionals who require powerful, yet easy-to-use PCs that offer the latest features and functionality, especially in wireless connectivity. In addition to built-in dual band 802.11a/g/n Intensi-fi solutions, the select Lenovo notebooks include (as standard features) Broadcom's Bluetooth(R) and Fast Ethernet networking technology. Lenovo 3000 notebooks also feature multimedia capabilities and a unique suite of easy-to-use productivity tools that help make owning and operating these widescreen notebooks a worry-free experience for small businesses and individual users.
Lenovo joins an elite list of leading PC OEMs that have now incorporated Broadcom's Intensi-fi technology into their products. This announcement expands the fast-growing ecosystem of products on the market enabled by Broadcom Intensi-fi solutions, making it by far the most popular draft-802.11n technology on the market.
Broadcom's Wireless LAN Product Family
Broadcom's high performance AirForce(TM) wireless LAN product line includes 54g (the world's most popular Wi-Fi technology) and Intensi-fi(TM) (the industry's first IEEE draft-802.11n chipsets). In addition to transceiver solutions that provide single- and dual-band wireless connectivity, Broadcom integrates wireless network processors, communications technologies and OneDriver(TM) software solutions into reference designs that speed customer time-to-market. Broadcom's Wi-Fi solutions are featured in the industry's leading brands of PCs, routers, peripherals, phones, broadband modems and consumer electronic devices.
Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).
Broadcom, one of the world's largest fabless semiconductor companies with annual revenue of more than $2.5 billion, is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com.
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Important factors that may cause such a difference for Broadcom in connection with Wi-Fi products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; uncertainties as a result of the company's previously-disclosed ongoing review of its practices in respect of options/equity grants to employees, and the publicized more general review of option grant practices throughout the technology and other industries by public regulatory bodies, and potential changes in accounting and other practices resulting there from; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for wireless networking applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.