Ultra-Low Power MSP430FG461x Sampling Today and ARM7(R)-based TMS470R1B1M MCUs Available in Volume Quantities Now
First Available MSP430 Device Using MSP430X Extended Architecture
Continuing the MSP430 ultra-low power MCU portfolio expansion the new MSP43FG461x series of devices is the first to incorporate the MSP430X architecture with an extended 1MB memory model, allowing access to 16 times more memory compared to the 64kB available today. New extended addressing modes designed for the large memory allow optimal high-level code density with full backward compatibility, making it possible to develop very sophisticated real-time applications completely in modular C libraries. Using the extended addressing modes, higher C code density and faster execution is achieved reducing the number of cycles by up to 25% when addressing peripherals, flash, or RAM and more than 50% for a full context store. More information on the new MSP430X CPU is available at http://www.ti.com/msp430 .
As the first MSP430X device, the MSP430FG461x MCU series includes up to 120KB of flash and up to 8KB RAM, offering a complete signal chain on chip (SCoC) solution ideal for portable medical devices like portable glucose meters, digital pulse oximeters and wireless electrocardiograms that require highly integrated intelligent peripherals and larger memory options on a single chip.
FG461x devices are the most highly integrated MSP430 MCUs to date. These devices include a 12-channel 200ksps successive approximation register (SAR), 12-bit analog to digital converter (ADC) with internal voltage reference; two 12-bit digital-to-analog converters (DACs) with one micro-second code-to-code settling time; three op-amps with 5 nano-amp input leakage current consumption; a direct memory access (DMA) controller for ultra-low power operation with no CPU intervention; a liquid crystal display (LCD) driver with regulated charge pump; one hardware real time clock featuring calendar and time registers; a 32-bit counter and universal serial communications interface (USCI) including UART, IrDA, SPI, and I2C.
The FG461x MCU consumes less than two micro-amps in a real time clock stand-by mode operation and allows operation from a single coin cell for up to ten years. The new devices also support multiple low power operating modes with a wake-up time of less than six micro-seconds and zero power brown out reset (BOR). The FG461x MCU series provides designers with pin-for-pin memory migration from the MSP430F449 MCU. Additional MSP430X-based device introductions are planned throughout 2007.
TMS470 Offers 1 MB On-Chip Flash
Available today in volume quantities, the ARM7TDMI(R) based TMS470R1B1M offers 1MB flash, 64KB RAM, and up to 60MHz of 32-bit performance for general purpose applications that include industrial, medical instrumentation, consumer electronics and data processing. This combination of performance, large on-chip flash memory, and external memory access allows designers to develop enhanced features like user interfaces that incorporate two-way audio for a home security panel as well as displaying instructions in multiple languages or incorporating a real time operating system (RTOS).
As one of five ARM7-based TI devices with more than 256KB of flash memory, the TMS470R1B1M MCU is a highly integrated solution including a unique, programmable, 32-channel high-end timer (HET) reduced instruction set computer (RISC) co-processor for greater accuracy in timing functions like period and pulse measurements, output compare, and pulse width modulations (PWMs). The HET co-processor runs in parallel and completely independently of the ARM7 CPU, providing significantly higher system performance. TMS470 MCUs also include a multi-buffered, 10-bit ADC with a 1.55 microsecond conversion time and a variety of industry standard peripherals that, like the HET, offload processing from the CPU. These include two high-end CAN controllers (HECC), five I2C modules, three serial communication interfaces, two serial peripheral interfaces (SPI), and a 16-channel Direct Memory Access (DMA) controller.
In-Person MCU Seminars Held Across the Globe
Designers interested in learning more about MSP430 MCUs can attend the fourth annual 430 Day held worldwide in 105 cities around the world, starting in May. Attendees of this free, three hour lunch-and-learn seminar will receive a free eZ430-F2013 complete MCU development tool to take home. In a compact Universal Serial Bus (USB) stick form factor, the eZ430 tool is the world's smallest complete MCU development and evaluation tool. For more information on location and dates for both events, see http://www.ti.com/mcu .
TI is also offering seminars in North America designed to familiarize users with the TMS470 MCU starting in late April for $199 per person. Attendees will receive a free TMDS-FET470R1B1M Kickstart development kit to take home. This development kit is a turnkey integrated environment that includes the TMS470R1B1M MCU processor board and peripheral board with the device signals pinned out, RS232 and CAN connectors, 16 LEDs, a 32 character LCD, four input buttons, an ADC potentiometer, temperature sensor, and prototyping area. It also has a 16K Kickstart version the IAR Compiler and integrated development environment.
Pricing and Availability
The MSP430FG461x series of MCUs will be available for sampling mid 2006. In volume, the devices will start at $9.45 per 1K quantities. TMS470R1B1M MCUs are immediately available in volume and start at $14.95 for 1K quantities.
TI Enables Innovation with Broad Range of Controllers
From ultra-low-power MSP430 and 32-bit general purpose TMS470 ARM7 family- based MCUs to high performance TMS320C2000(TM) digital signal controllers, TI offers designers the broadest range of embedded control solutions. Designers can also accelerate their design to market by tapping into TI's complete software and hardware tools, extensive third party offerings and technical support. For more information on the broad range of TI's controllers, see http://www.ti.com/mcu .
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
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