Mobileye Chooses Sonics SMART Interconnect as Foundation For New Automotive SoC; Deal Highlights Benefits of Outsourcing Complex SoC Design

MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—Jan. 10, 2006— Sonics, Inc.(R), the premier supplier of system-on-chip (SoC) SMART Interconnects(TM), today announces the selection of SonicsMX(TM) by Mobileye N.V., the leading provider of advanced driver assistance systems for the automotive industry, for design into that company's second generation single-camera driving assistance SoC. Mobileye's decision substantiates the effectiveness of SonicsMX for multimedia streaming applications, as well as the trend by electronics companies to outsource their complex SoC interconnect design for improved economics and time to market.

The need to consolidate many popular driver assistance applications, such as adaptive cruise control, lane departure warning, lane change assistance, forward collision warning, pedestrian detection, and traffic sign detection, onto a single SoC creates complexities when designing these types of devices. Additionally, the streaming nature and real-time processing aspects of multimedia SoCs, like those from Mobileye, require high performance and data bandwidth control. SonicsMX is designed to effectively control on-chip performance and data bandwidth.

"The SoCs we design have both ultra high-performance video processing and real-time data transactions that require a proven, efficient and reliable interconnect architecture structure," says Elchanan Rushinek, vice president of engineering at Mobileye Vision Technologies, Mobileye's Israel-based R&D subsidiary. "The rich set of data flow services built into SonicsMX allows us to address the complex data flows associated with these extraordinarily difficult requirements more rapidly than attempting to design something equivalent by ourselves. By focusing our engineering efforts on architecture and system integration issues we can also significantly lower our development cost and time to market."

The Mobileye SoC represents the first time a Sonics SMART Interconnect is being used in the automotive industry. The continued expansion of Sonics' applications space also highlights the continuing transformation of the semiconductor industry towards a platform architecture approach, and Sonics as the catalyst for these industry changes.

About Sonics

Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see

Sonics is a registered trademark and SMART Interconnects and SonicsMX are trademarks of Sonics, Inc. All other trademarks are the property of their respective owners.

Acclaim Public Relations
Nancy Sheffield, 408-269-0849

Email Contact


Review Article Be the first to review this article
CST: Webinar


Featured Video
Currently No Featured Jobs
Upcoming Events
SEMICON Japan 2018 at Tokyo Big Site Ariake Koto-ku Tokyo Japan - Dec 14, 2018
EDAPS 2018 at TAJ CHANDIGARH SECTOR 17A Chandigarh India - Dec 16 - 18, 2018
VLSID 2019 at Delhi India - Jan 5 - 9, 2019
CES 2019 at Las Vegas NV - Jan 8 - 11, 2019
CST: eseminar

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise