Broadcom Announces Industry's First Dual DVB-S2 Receiver Chip for Digital Satellite Broadcast Equipment

Advanced DVB-S2 Receiver Chip First to Integrate Dual Tuners and Demodulators, Resulting in Significant Reductions in System Board Space, Power and Cost

LAS VEGAS, 2006 International CES, Jan. 5 /PRNewswire-FirstCall/ -- Broadcom Corporation (NASDAQ: BRCM), a global leader in wired and wireless broadband communications semiconductors, today announced the industry's first DVB-S2 (digital video broadcast -- satellite version 2) receiver chip that features two integrated tuners and demodulators. The capabilities of the new Broadcom(R) receiver go beyond current DVB-S2 silicon implementations in both integration and performance, offering manufacturers a significantly lower cost solution for the development of DVB-S2 capable satellite set-top boxes (STBs), personal video recorders (PVRs), satellite receivers and integrated multi-functional home media centers.

DVB-S2 is an advanced satellite transmission specification that expands and improves upon the earlier DVB-S standard that is deployed in integrated receiver/decoder (IRD) solutions all over the world. The new standard offers improved modulation efficiency over the DVB-S standard. In addition, when combined with new video compression technologies such as H.264 (MPEG-4 Part 10/AVC) for high-definition television broadcast and interactive TV services, DVB-S2 further improves bandwidth efficiency for accommodating additional content and high quality programming for consumers.

Broadcom is the first company to develop a DVB-S2 satellite receiver chip that integrates the demodulators and tuners into a single-chip design. Other silicon solutions require separate DVB-S2 tuners and demodulators, which significantly increase the number of components on the receiver design and result in increased bill of material costs as well as power consumption. Announced today is Broadcom's new BCM4501 DVB-S2 receiver chip that integrates two tuners and two demodulators, reducing the number of components on a dual DVB-S2 receiver design from four chips to one and reducing power consumption by more than 40% over current multi-chip devices. These reductions significantly lower the system bill-of-material costs and reduce the complexity of dual tuner DVB-S2 satellite receiver designs.

"We are pleased to provide this highly integrated satellite front-end solution to customers today especially when advanced satellite products are being rolled out in volume production," said Brian Sprague, Senior Director of Marketing for Broadcom's Set-Top Box Line of Business. "By providing a single-chip design that includes dual tuners and demodulators, Broadcom is once again enabling satellite equipment manufacturers to reduce system board space, power and cost for their high definition set-top box platforms."

"With a growing number of HDTV channels to be delivered by satellite pay-TV providers in 2006, those pay-TV providers are looking to the higher capacity enabled by DVB-S2 for more efficient HD channel delivery," said Michelle Abraham, Principal Analyst at InStat. "In 2009, we expect satellite set-top boxes with next-generation advanced modulation technologies to account for 30% of the worldwide satellite set-top box unit shipments."

The BCM4501 DVB-S2 receiver provides a seamless interface to Broadcom's BCM7400, BCM7401 and BCM7402 AVC/MPEG-2/VC-1 single-chip solutions as well as to the BCM7038/BCM7411 decoder chipset, offering solutions for set-top boxes that can simultaneously support one or two high definition (HD) AVC broadcast channels. Two HD AVC channels enable end users to watch an HD AVC program while recording another or to record multiple programs at the same time. The BCM4501, when combined with the BCM7400 (also announced today), is the industry's first two-chip solution for dual HD-AVC decode, dual HDTV or dual HD picture-in-picture set-top box configurations.

BCM4501 Product Information

The BCM4501 is a dual DVB-S2 satellite receiver chip that integrates two CMOS tuners and two advanced demodulators supporting DVB-S2, DVB-S and DIRECTV(R) broadcast applications. The new receiver chip can support all high volume, advanced modulation DVB-S2 and DIRECTV network deployments while maintaining backward compatibility with DVB-S and DigiCipher II satellite networks. An Integrated Frequency Translation Module transceiver/communication link enables the BCM4501 to cost-effectively support multiple low noise block (LNB) configurations over a single coax cable connection that eases home installations while reducing cable requirements in the home.

Pricing and Availability

The BCM4501 DVB-S2 satellite receiver chip is available today and is priced at $25 in quantities of 1,000 units or more. The BCM4501 is packaged in a 208-pin MQFP.

Broadcom's Broadband Business Group

Broadcom offers manufacturers a range of broadband communications and consumer electronics SoCs that enable voice, video and data services over residential wired and wireless networks. These highly integrated silicon solutions continue to enable the most advanced system solutions on the market, which include digital cable, satellite and IP set-top boxes and media servers, broadband modems and residential gateways, high definition and digital televisions, HD DVD players and personal video recorders.

About Broadcom

Broadcom Corporation is a global leader in wired and wireless broadband communications semiconductors. Our products enable the convergence of high-speed data, high definition video, voice and audio at home, in the office and on the go. Broadcom provides manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices with the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions. These solutions support our core mission: Connecting everything(R).

Broadcom is one of the world's largest fabless semiconductor companies, with annual revenue of more than $2 billion. The company is headquartered in Irvine, Calif., with offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com.

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with satellite set-top box and personal video recorder products and such as the BCM4501 include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for satellite set-top box and HDTV applications; delays in the adoption and acceptance of industry standards in those markets; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with experience and capabilities, and at the compensation levels needed to implement our business and product plans; the gain or loss of a key customer, design win or order; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; the quality of our products and any remediation costs; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

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