IC Interconnect Announces New Wire-Bonding Process for High-Temperature Applications; Electroless Ni/Immersion Au Process Receives Positive Customer Reviews as a Wire Bond Surface after Rigorous Testing

COLORADO SPRINGS, Colo.—(BUSINESS WIRE)—Oct. 17, 2005— IC Interconnect, a wafer bumping service company, announces qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high temperatures with a thinner gold layer. These special high-temperature wire bonds are especially useful in avionics and automotive applications, and require no additional lead time for production. IC Interconnect's process eliminates the Kirkendall voiding that takes place in an Al/Au interface at 200(degrees)C thermal exposures.

IC Interconnect successfully uses a 0.1 um thick gold layer where other companies require at least 1 um of gold or thicker. "Many people don't believe that a thinner gold layer can hold up to the stress caused by their application," says Christine Jauernig, process engineer for IC Interconnect. "Products made with our Ni/Au process have been tested and qualified by several customers."

Nickel/gold pad resurfacing also benefits copper-based ICs. To avoid Cu corrosion in plastic packaging, there are two solution paths -- aluminum plating on copper pads, which is expensive, or nickel/gold plating on copper pads. The second option is maskless, eliminating costs associated with thin film sputter, photo lithography and metal etch.

"Electroless Ni/Immersion Au is an inexpensive method to enable standard gold wire bonding to be extended to the thermal demands (200(degrees)C) required of today's state-of-the-art electronics," says Curt Erickson, president of IC Interconnect.

This application contributes to IC Interconnect's extensive list of manufacturing qualifications for automotive, aerospace and other high-reliability applications. The company is currently ISO/TS 16949.

For more information on IC Interconnect's breakthrough developments, please visit www.icinterconnect.com/wirebond.htm.

IC Interconnect

IC Interconnect, located in Colorado Springs, was founded in 1998 as part of The Eagle Electronics group to provide wafer bumping services to the semiconductor industry. IC Interconnect fills a unique niche, providing fast delivery of high quality flip chip parts at competitive prices. IC Interconnect provides wafer bumping services and electroless nickel and immersion gold plating and pad resurfacing for semiconductor devices. IC Interconnect can process over 240,000 wafers/year and has a standard turn time of 5 days. More information is available at http://www.icinterconnect.com.

IC Interconnect
Tony Gaines, 719-533-1030 x 36

Email Contact
Origin Communications
Jil Goebel or Jessica Seybold, 719-785-9900

Email Contact
Email Contact

Review Article Be the first to review this article

Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
H-1B Visa: de Geus’ tragedy looms large
Peggy AycinenaIP Showcase
by Peggy Aycinena
IP for Cars: Lawsuits are like Sandstorms
More Editorial  
Lead Java Platform Engineer IOT-WEB for EDA Careers at San Francisco Area, CA
Mechanical Designer/Engineer for Palo Alto Networks at Santa Clara, CA
Technical Support Engineer for EDA Careers at Freemont, CA
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
ASIC/FPGA Design Engineer for Palo Alto Networks at Santa Clara, CA
CAD/CAM Regional Account Manager (Pacific Northwest) for Vero Software Inc. at Seattle, WA
Upcoming Events
Embedded Systems Conference ESC Boston 2017 at Boston Convention & Exhibition Center Boston MA - May 3 - 4, 2017
2017 GPU Tech Conference at San Jose McEnery Convention Center 150 West San Carlos Street San Jose CA - May 8 - 11, 2017
High Speed Digital Design and PCB Layout at 13727 460 Ct SE North Bend WA - May 9 - 11, 2017
Nanotech 2017 Conference & Expo at Gaylord National Hotel & Convention Center WA - May 14 - 17, 2017

Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy