IC Interconnect Announces New Wire-Bonding Process for High-Temperature Applications; Electroless Ni/Immersion Au Process Receives Positive Customer Reviews as a Wire Bond Surface after Rigorous Testing

COLORADO SPRINGS, Colo.—(BUSINESS WIRE)—Oct. 17, 2005— IC Interconnect, a wafer bumping service company, announces qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high temperatures with a thinner gold layer. These special high-temperature wire bonds are especially useful in avionics and automotive applications, and require no additional lead time for production. IC Interconnect's process eliminates the Kirkendall voiding that takes place in an Al/Au interface at 200(degrees)C thermal exposures.

IC Interconnect successfully uses a 0.1 um thick gold layer where other companies require at least 1 um of gold or thicker. "Many people don't believe that a thinner gold layer can hold up to the stress caused by their application," says Christine Jauernig, process engineer for IC Interconnect. "Products made with our Ni/Au process have been tested and qualified by several customers."

Nickel/gold pad resurfacing also benefits copper-based ICs. To avoid Cu corrosion in plastic packaging, there are two solution paths -- aluminum plating on copper pads, which is expensive, or nickel/gold plating on copper pads. The second option is maskless, eliminating costs associated with thin film sputter, photo lithography and metal etch.

"Electroless Ni/Immersion Au is an inexpensive method to enable standard gold wire bonding to be extended to the thermal demands (200(degrees)C) required of today's state-of-the-art electronics," says Curt Erickson, president of IC Interconnect.

This application contributes to IC Interconnect's extensive list of manufacturing qualifications for automotive, aerospace and other high-reliability applications. The company is currently ISO/TS 16949.

For more information on IC Interconnect's breakthrough developments, please visit www.icinterconnect.com/wirebond.htm.

IC Interconnect

IC Interconnect, located in Colorado Springs, was founded in 1998 as part of The Eagle Electronics group to provide wafer bumping services to the semiconductor industry. IC Interconnect fills a unique niche, providing fast delivery of high quality flip chip parts at competitive prices. IC Interconnect provides wafer bumping services and electroless nickel and immersion gold plating and pad resurfacing for semiconductor devices. IC Interconnect can process over 240,000 wafers/year and has a standard turn time of 5 days. More information is available at http://www.icinterconnect.com.



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