InterDigital Announces the Availability of Its Advanced HSDPA Coprocessor ASIC; Implementation Supports Category 10 HSDPA Solution

KING OF PRUSSIA, Pa.—(BUSINESS WIRE)—Oct. 7, 2005— InterDigital Communications Corporation (Nasdaq: IDCC) today announced the availability of its UMTS Release 5 HSDPA (High Speed Downlink Packet Access) coprocessor terminal unit ASIC (Application Specific Integrated Circuit) in accordance with its announced schedule. InterDigital's HSDPA technology, verified now in ASIC form, optimally supports all service categories up to Category 10 (14 Mbps) for incorporation into mobile terminal devices.

Fabricated using 130 nanometer technology and designed to be process independent, InterDigital's HSDPA coprocessor includes the following features:

    --  Compliance with UMTS Release 5;

    --  Low power consumption;

    --  Low MIPS requirements;

    --  Low-profile package (8 x 8mm with 132 pin Ball Grid Array);

    --  Flexible design allows for customized OEM implementation;

        --  Optimally supports all categories;

        --  Design can be scaled to customer targeted categories;

        --  Easy integration with existing UMTS Release 99/Release 4

    --  Supports transmit and receive diversity;

    --  Already meets stricter UMTS Release 6 requirements;

    --  Architecture scalable to Release 6 HSUPA (High Speed Uplink
        Packet Access).

InterDigital offers its standards-compliant HSDPA technology solution as a separate coprocessor which can be adapted to interface with any UMTS Release 99/Release 4 offering. InterDigital's solution can also be provided to a customer as technology blocks for incorporation into existing UMTS Release 99/Release 4 chips. InterDigital recently announced Philips Semiconductor, NV as its first HSDPA technology customer.

InterDigital's HSDPA coprocessor incorporates an advanced receiver (chip level equalizer) which is the key enabler in achieving high data rate performance and meeting the stricter performance levels for UMTS Release 6.

HSDPA technology provides wireless equipment producers and semiconductor suppliers with the next step in the evolution of their 3G UMTS terminal products. HSDPA allows operators to increase network capacity, lower their cost per bit and provide mobile users with improved access to the Internet and enhanced download capability for email, music and video content.

"At 3GSM World Congress earlier this year, we demonstrated our advanced receiver-based HSDPA solution in an FPGA form," said Mark Lemmo, Senior Business Development and Product Management Officer. "The implementation of HSDPA as a coprocessor validates our market leadership in the delivery of advanced 3G technologies. Our mature, scalable HSDPA solution complements our UMTS Release 99/Release 5 protocol software solution and provides a migration path to HSUPA."

To learn more about InterDigital's technology and product solution offerings, contact

About InterDigital

InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. The company offers technology and product solutions for wireless applications that deliver time-to-market and cost advantages, as well as performance improvements and product differentiation opportunities for its customers. InterDigital has a strong portfolio of patented technologies covering 2G, 2.5G, 3G and 802 standards, which it licenses worldwide. For more information, please visit InterDigital's web site: InterDigital is a registered trademark of InterDigital Communications Corporation. All other trademarks are the property of their respective owners.

InterDigital Communications Corporation
Media Contact:
Dawn Goldstein, 610-878-7800

Email Contact
Investor Contact:
Janet Point, 610-878-7800

Email Contact

Review Article Be the first to review this article

Featured Video
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Upcoming Events
Methodics User Group Meeting at Maxim Integrated 160 Rio Robles San Jose CA - Jun 5 - 6, 2018
2018 FLEX Korea at Room 402/ 403, COEX Seoul Korea (South) - Jun 20 - 21, 2018
DAC 2018 at Moscone Center West San Francisco CA - Jun 24 - 28, 2018
IEEE 5G World FOrum at 5101 Great America Parkway Santa Clara CA - Jul 9 - 11, 2018
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise