Texas Instruments Breaks 65nm Leakage Power Barrier with SmartReflex(TM) Technologies

Intelligent, Adaptive SmartReflex Power and Performance Management Technologies Solve Power Consumption Challenges for Advanced Mobile Devices

DALLAS, Sept. 19 /PRNewswire/ -- The potential for leakage power or battery life drain increases dramatically as the industry advances to smaller process node geometries, a challenge that has been viewed as a barrier for developing high-speed, high-integration, low-power 65nm mobile devices. Texas Instruments Incorporated (NYSE: TXN) (TI) announced today it has solved the 65nm leakage power challenge for mobile devices with its SmartReflex(TM) power and performance management technologies, opening the door for new wireless entertainment, communications and connectivity applications in advanced mobile devices. TI's SmartReflex technologies are a combination of intelligent and adaptive silicon, circuit design and software designed to solve power and performance management challenges at smaller process nodes, enabling OEMs to offer sleeker, multimedia-enabled mobile devices with long battery life and less heat dissipation.

Historically, power consumption challenges have been managed through limited, simple approaches such as idle/sleep modes, clock gating and dynamic voltage and frequency scaling (DVFS) that focus on dynamic power, not leakage power. However, the convergence of communications, computing and entertainment onto mobile devices has led to higher levels of silicon integration at smaller, more cost-effective process nodes. The combination of higher performance processing needs and the dramatic increase in leakage power from advanced processes creates a severe power management challenge that requires a more comprehensive system-level solution.

"Performance-hungry multimedia and productivity applications are generating new opportunities for marketplace growth, but not without posing power and performance challenges at the silicon level," said Bill Krenik, TI's wireless advanced architecture manager, Wireless Terminals Business Unit. "TI's SmartReflex technologies are the bridge to addressing critical process issues head on -- taking leaps to reduce leakage power, boost performance and manage heat dissipation while enabling more features on mobile devices."

TI's SmartReflex technologies go well-beyond traditional device power management techniques by solving the critical issue of leakage power in 65nm for mobile devices. Specifically, TI's SmartReflex product-proven technologies incorporate a system-level approach, from integrated circuit design to system software that guarantees performance while aggressively addressing the power consumption challenge for mobile devices at deep sub- micron process nodes. Leveraging TI's power management-focused silicon IP, System on Chip (SoC) design, and system software, SmartReflex technologies extend to the entire SoC and incorporate a broad range of intelligent and adaptive hardware and software technologies that dynamically control voltage, frequency and power based on device activity, modes of operation and process and temperature variation. This saves additional power without compromising end performance to run complex multimedia applications.

"Power and performance management is becoming a major battleground for the wireless industry, as new process technologies and more features threaten to erode battery life. TI's new SmartReflex technologies appear to be the most comprehensive response yet to this challenge," said Chris Ambarian, senior analyst, power management, iSuppli Corporation. "As semiconductor innovation pushes into the deep sub-micron process range, power and performance management strategies must evolve to capture the full benefits of smaller design features. TI's system-level approach with its SmartReflex technologies can be used to significantly reduce power consumption per function -- an important enabling factor in the continued expansion of wireless entertainment, gaming and music applications on advanced mobile devices."

TI first introduced technology elements of SmartReflex technologies at the 90nm process node and is now applying advanced techniques of the solution to 65nm. Technology components of SmartReflex have been integrated into over 100 million mobile devices. TI is incorporating the technology in its family of OMAP(TM) 2 applications processors and has plans to introduce incrementally more advanced SmartReflex technologies in future generations of wireless products.

TI at Portable Power 2005

TI is exhibiting at booth #2 during Portable Power 2005, held September 18-21 in San Francisco. Key TI wireless and power management experts will address conference attendees and will be available to provide information on the company and its SmartReflex technologies. TI speaking engagements include:

     *  Dave Heacock, vice president, Portable Power Management, High-
        Performance Analog
        Battery Track Tutorial: Power Management
        Sunday, September 18th
        3:00-5:00 p.m.

     *  Bill Krenik, wireless advanced architecture manager, Wireless
        Terminals Business Unit
        Power Management Challenges: Power Consideration for Mobile Device
        Monday, September 19th
        2:30-3:30 p.m.

     *  John Qian, battery management applications manager, Portable Power
        High-Efficiency 1.1-MHz Battery Charging
        Tuesday, September 20
        11:00 a.m.-12:30 p.m.

     *  David Jarrett, senior technical staff, Broadband Applications
        Voice over Internet Protocol (VoIP) - Impact and Direction
        Tuesday, September 20
        3:00-3:30 p.m.

     *  Todd Vanyo, applications manager, Portable Power Management
        Electronic Alternatives to Battery Authentication
        Sunday, September 18
        12:30-2:30 p.m.

For information on Portable Power 2005, please visit: http://www.portablepower2005.com/ .

Texas Instruments - Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 16 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, GPS, Digital TV, Bluetooth and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit http://www.ti.com/wirelesspressroom for additional information.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com .

Safe Harbor Statement

Statements contained in this news release regarding the growth of the wireless market, TI market penetration and qualification of TI products and other statements of management's beliefs, goals and expectations may be considered forward-looking statements as that term is defined in the Private Securities Litigation Reform Act of 1995, and are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by these statements. The following factors and the factors discussed in TI's most recent Form 10-K could cause actual results to differ materially from the statements contained in this news release: actual market demand for wireless products and TI semiconductor products specifically, and actual certification test results relating to TI products. TI disclaims any intention or obligation to update any forward-looking statements as a result of developments occurring after the date of this news release.


SmartReflex and OMAP are trademarks of Texas Instruments. All other trademarks and registered trademarks are property of their respective owners.

CONTACT: Renee Fancher of Texas Instruments Incorporated, +1-214-567-7447,
or Email Contact ; or Matt McKinney, +1-214-480-6894, or
Email Contact , for Texas Instruments Incorporated. Please do not
publish these e-mail addresses or phone numbers.

Web site: http://www.ti.com/ http://www.portablepower2005.com/

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