Broadcom's Announces New Single-Chip Mobile VoIP Processor for Wi-Fi(R) Phones

Second Generation Mobile VoIP Processor Chip Provides the Industry's Most Highly Integrated Solution for Multimedia Voice and Video Applications

BOSTON, Fall 2005 VON Conference & Expo, Sept. 19 /PRNewswire-FirstCall/ -- Broadcom Corporation (NASDAQ: BRCM), a global leader in wired and wireless broadband communications semiconductors, today announced a new second generation mobile Voice over Internet Protocol (VoIP) processor designed specifically for Wi-Fi(R) phones that feature advanced multimedia and telephony capabilities. This single-chip VoIP processor enables a compelling new class of multimedia voice and video applications such as video streaming, digital cameras, video conferencing and data connectivity, all not available from the typical cordless phones used in homes today.

Home entertainment products are evolving to embrace the new digital revolution. Radios, portable tape players, VCRs and TV sets are now being replaced with MP3 players, CD players, DVD players and HDTV sets. On the other hand, the home telephone has changed very little to date and has not taken advantage of many new multimedia technologies as of yet. Today's Wi-Fi phones are beginning to leverage the convergence of VoIP and WLAN, enabling the handsets to not only provide leading edge performance and features, but also to interoperate with new home entertainment appliances. To enhance VoIP phones, Broadcom chips feature advanced compression techniques (such as BroadVoice(TM)32) for a superior audio experience.

"The performance and voice quality achieved through our BroadVoice32 technology allow phone calls to be near CD-quality," said Patrick Sullivan, Vice President and General Manager of Broadcom's VoIP phone products. "This provides a significant differentiator to those service providers who offer VoIP service when compared to traditional phone service."

Announced today is the Broadcom(R) BCM1161 -- a second generation mobile VoIP processor that focuses on low-power and advanced multimedia and telephony functions. The BCM1161's advanced multimedia features include polyphonic ring-tone support, a 2 Megapixel digital camera, voice record/playback and video clips record/playback. A variety of telephony features are also supported by the BCM1161 including 3-way conferencing and speaker phone support, and high-fidelity voice capabilities through the use of Broadcom's BroadVoice technology. The new single-chip integrates an ARM9(TM)-based CPU, analog voice codec with a direct microphone and high-output speaker interface, 262k color LCD display interface and a USB 2.0 interface.

"Selecting Broadcom as the supplier for our Wi-Fi phones was an easy decision due to its product breadth and leadership position within both the VoIP and WLAN markets," said Larry Lee, Vice President of the DataCom Business Unit of Wistron Neweb. "The BCM1161 mobile VoIP processor platform has allowed Wistron Neweb to develop a high-quality product with good voice quality, range, battery life and support for the latest security and QoS standards."

To reduce customers' time-to-market with new product designs, Broadcom has developed the BCM91161 Wi-Fi VoIP phone reference design. The BCM91161 includes Broadcom's xChange(TM) VoIP software suite, Session Initiation Protocol (SIP) call signaling stack, WLAN OneDriver(TM) and a LinuxOS-based board support package, including all necessary drivers and software development tools. This kit is available today to developers as a wireless IP phone handset with a comprehensive hardware reference design support package.

Availability

Broadcom's BCM1161 mobile VoIP processor is available today and will be offered in next-generation Wi-Fi phones from leading ODMs such as Alpha Networks, Moimstone and Wistron Neweb. Demonstrations for the Broadcom reference design as well as ODM partner products will be shown September 19th through 22nd at the Fall VON 2005 Conference & Expo (Boston Convention and Exhibition Center).

About Broadcom

Broadcom Corporation is a global leader in wired and wireless broadband communications semiconductors. Our products enable the convergence of high- speed data, high definition video, voice and audio at home, in the office and on the go. Broadcom provides manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices with the industry's broadest portfolio of state-of-the-art system-on- a-chip and software solutions. These solutions support our core mission: Connecting everything(R).

Broadcom is one of the world's largest fabless semiconductor companies, with annual revenue of more than $2 billion. The company is headquartered in Irvine, Calif., with offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com.

Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with VoIP products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for VoIP networking applications; delays in the adoption and acceptance of industry standards in those markets; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; the quality of our products and any remediation costs; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the timing of customer-industry qualification and certification of our products and the risks of non- qualification or non-certification; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.

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