Melvill's keynote presentation, delivered at the San Jose Convention Center, elaborates on his experience as the first civilian astronaut to pilot the experimental SpaceShip One into space. The privately funded human spaceflight mission made history on June 21, 2004 and later won his team the $10 million Ansari X prize for the accomplishment.
Melvill's keynote likens the excitement of spaceflight innovation to the excitement that drives the success of the foundry industry. Just as Melvill and his team at Scaled Composites used innovative design to produce breakthrough results, TSMC partners with small startups and large design teams to produce innovative chip designs that result in breakthrough products.
"Mike Melvill was a natural choice for this year's keynote, as he exemplifies the spirit of innovation through all of his endeavors," said Rick Cassidy, President of TSMC North America. "Mr. Melvill's achievements illustrate the importance of partnering for innovation, just as TSMC collaborates with its partners to launch some of the world's breakthroughs in technology."
Melvill and TSMC also jointly donated a set of exciting photographs from this historic flight as the first contribution to a brand-new IISME Resource Library that will provide teachers with the tools they need to invigorate interest in science and engineering among Silicon Valley students. TSMC is also partnering with IISME to help Silicon Valley teachers gain hands-on experience working in a semiconductor company, with the hope of inspiring future generations of youth to pursue innovative careers in science and engineering.
TSMC's Technology Symposium is an annual day-long event held in San Jose. The event also takes place in other major U.S. cities, including Boston on April 29 and Austin on May 2, as well as internationally in Asia and Europe. At each conference, TSMC customers and partners hear the latest developments in the company's technology from TSMC's engineers and executives.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates two advanced 300mm wafer fabs, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at its wholly-owned subsidiary, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. In early 2001, TSMC became the first IC manufacturer to announce a 90nm technology alignment program with its customers. TSMC's corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
TSMC North America Dan Holden, 408-382-7921 or 408-910-1141 (cell) Email Contact