Micron Technology, Inc., Announces First to Receive Intel Validation of 4 Gigabyte DDR2 RDIMMs Using Stacked Components

Highest-Density DDR2 Registered DIMM Available for Enterprise Servers and Workstations

BOISE, Idaho—(BUSINESS WIRE)—April 11, 2005— Micron Technology, Inc. (NYSE: MU), today announced it is the first supplier to validate 4 gigabyte (GB) DDR2 registered dual inline modules (DIMMs), and the first to validate a high-density DDR2 module solution employing stacked component technology, with Intel. The industry-standard, 240-pin PC2-3200 DDR2 RDIMM, is populated with thirty-six 1Gb DDR2 components using Staktek's high-performance Stakpak(R) technology. Micron's 4GB RDIMM, MT36HTJ51272Y-40E, is in production and currently available to customers.

"Micron's latest 4GB DDR2 RDIMM and the underlying stacked 1Gb DDR2 technology is the first to pass Intel's module validation," said Tom Macdonald, vice president and general manager of Intel's Advanced Chipset Division. "DDR2 validation and production availability from key memory suppliers such as Micron is important in enabling Intel(R) architecture-based server platform customers with the latest high-density solutions."

"Intel platform validation of 4GB DDR2 RDIMMs solidifies our leadership position in both server memory technology and DDR2 products," said Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for Micron's Systems Memory Group. "These devices are the highest-density modules available today, enabling server and workstation customers to ship systems containing 16GB of DDR2 memory while only populating four module slots. Micron offers the broadest DDR2 product solutions available today for meeting the memory requirements of notebook, desktop, and server computing products."

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, Flash memory, CMOS image sensors, other semiconductor components and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit its Web site at www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. Intel is a registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. All other trademarks are the property of their respective owners.



Contact:
Micron Technology, Inc.
Echo Chadwick, 208-368-4400

http://www.micron.com



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