Toshiba Expands CMOS Image Sensor Product Lineup With 2-Megapixel CMOS Image Sensor Chip

New CMOS Image Sensor Provides High-End Camera Phone Users With Great Visual Experience, Even in Low-Light Conditions

SAN FRANCISCO, March 7 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the availability of a new 2-megapixel CMOS image sensor chip targeted at high-end camera-enabled mobile handset applications, including Smartphones. Designated ET8EA3-AS, the new chip has a small 3.3 micron (um) x 3.3um pixel size with a 1/2.7-inch optical format and incorporates an analog-to-digital (A/D) converter. TAEC will be showing working samples at the Embedded Systems Conference here this week.

"With the launch of our new 2-megapixel ET8EA3-AS CMOS image sensor, Toshiba can support the higher-resolution camera requirements of cell phone manufacturers," said Andrew Burt, director of the Wireless Business Unit at TAEC. "We believe camera phones will start to compete effectively with low- end digital still cameras at the 2-megapixel level. We expect our new device will accelerate that trend and reinforce Toshiba's CMOS imaging leadership." He noted that Toshiba CMOS image sensors have proven their superiority in image quality comparisons by offering demonstrably better color balance and picture quality, even in dark-light conditions.

Key Features

The ET8EA3-AS CMOS image sensor is an area color image sensor that incorporates an A/D converter in non-diced wafer form; key features include the following:

  * Adoption of a square pixel, each 3.3 x 3.3um, achieves approximately
    2 megapixels of array resolution in a 1632 horizontal by 1216 vertical
    array with a 1/2.7-inch optical format

  * Capable of up to 15 frame-per-second (fps) operation for full-resolution

  * Achieves low-power consumption engendered by Toshiba's renowned CMOS
    process technology

  * Toshiba's advanced sensor technology and sophisticated signal processing
    technology result in excellent picture quality

  * Can use with a companion Toshiba DSP chip that provides YUV or JPEG
    encoded data or employ another suitable external DSP chip

  Toshiba CMOS Image Sensor Product Line

Cell phones, including the new Smartphones, increasingly incorporate built-in video- and still-image capabilities. CMOS image sensors are widely used in such products as they enjoy advantages in small size and low-power consumption compared to CCDs. Toshiba's CMOS image sensors employ a special square pixel design that enables them to achieve CCD-quality images with low-power consumption, even in low-light conditions. Recognized for its excellence in CMOS imaging, Toshiba currently offers the TCM8230MD VGA camera module, the TCM8240MD 1.31-megapixel camera module and the new ET8EA3-AS 2-megapixel CMOS image sensor chip. 3.2-megapixel chips are under development at Toshiba.

Pricing and Availability

Samples of the ET8EA3-AS are currently available with mass production planned for June, 2005. Pricing is $25.00 each in 10,000-piece quantities.

   Technical Specification Summary

   Part Number         ET8EA3-AS
   Optical Format      1/2.7 inch
   Output Pixel        1632 (H) x 1216 (V)
   Pixel Size          Square pixel: 3.3um (H) x 3.3um (V)
   Image Size          5.386mm (H) x 4.013mm (V)
   Scanning            Progressive-scanning
   Color Filter        RGB primary color filter, Bayer arrangement
   Output Data         RAW data, 12-bit parallel
   External Clock      6 to 20MHz, including phase-locked loop
    Frequency Range
   Frame Rate          15 frames per second (fps)/7.5fps @ UXGA output
                       30fps/15fps/7.5fps @ SVGA output
   Interface Control   I(2)C bus
   Power Supply        2.8 +/- 0.2 Volts (V) or 1.5 +/- 0.1V
   Power Consumption   2.8V:  20mA (typical) at 30fps
                       1.5V:  60mA (typical) at 30fps
   Operating           -20 degrees - 60 degrees C
   Functionality       Automatic blemish detection and correction, lens
                       shading compensation, variable electronic shutter,
                       variable gain control,  built-in feedback clamp
   Package             Non-diced wafer

  *About TAEC

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes semiconductors, flash memory-based storage solutions, and displays for the computing, wireless, networking, automotive and digital consumer markets.

TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, one of the five largest semiconductor companies worldwide in terms of global sales for the year 2003 according to Gartner/Dataquest's Worldwide Semiconductor Market Share Ranking. Toshiba is a world leader in high-technology products with more than 300 major subsidiaries and affiliates worldwide. For additional company and product information, please visit TAEC's website at For technical inquiries, please e-mail Email Contact.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at, or from your TAEC representative.

All trademarks and tradenames used herein are the properties of their respective holders.

CONTACT: Judy Kahn, +1-650-948-8881, Email Contact, for TAEC;
or Deborah Chalmers of Toshiba America Electronic Components, Inc.,
+1-408-526-2454, Email Contact

Web site:

Web site:

Review Article Be the first to review this article
 True Circuits: IOT PLL

Featured Video
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Upcoming Events
Methodics User Group Meeting at Maxim Integrated 160 Rio Robles San Jose CA - Jun 5 - 6, 2018
2018 FLEX Korea at Room 402/ 403, COEX Seoul Korea (South) - Jun 20 - 21, 2018
DAC 2018 at Moscone Center West San Francisco CA - Jun 24 - 28, 2018
IEEE 5G World FOrum at 5101 Great America Parkway Santa Clara CA - Jul 9 - 11, 2018
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise