MEDIA ALERT: ProPlus Design Solutions to Exhibit at TSMC OIP Ecosystem Forum(R)
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MEDIA ALERT: ProPlus Design Solutions to Exhibit at TSMC OIP Ecosystem Forum(R)

SAN JOSE, CA -- (Marketwired) -- Sep 13, 2016 --

WHO: ProPlus Design Solutions, Inc., the leading technology provider of giga-scale SPICE simulation and nano-scale SPICE modeling solutions

WHAT: Will showcase its giga-scale SPICE simulators NanoSpice™ and NanoSpice Giga™, along with ME-Pro™, a design-assistant tool for process and device evaluation for circuit design, CAD and process development teams, during the TSMC 2016 Open Innovation Platform® (OIP) Ecosystem Forum

WHEN: Thursday, September 22, from 8 a.m. until 6:30 p.m.

WHERE: San Jose McEnery Convention Center, San Jose, Calif.

Demonstrations will highlight how to:

The ProPlus Design Solutions website with more information can be found at:

For more details about the TSMC OIP Ecosystem Forum, visit:

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry's golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at

BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions 
(617) 437-1822 

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