SAN JOSE, Calif. – May 4, 2016 – SEMI today announced the appointment of Melissa Grupen-Shemansky, Ph.D., as Chief Technology Officer (CTO) for the FlexTech Group and for SEMI’s Advanced Packaging program. With over 20 years of experience in the semiconductor industry, Grupen-Shemansky has a strong background in R&D, manufacturing, business development, and technology strategy. She will oversee FlexTech’s flexible hybrid electronics (FHE) and Nano-Bio Manufacturing Consortium (NBMC) R&D programs and technology advisory councils. Grupen-Shemansky will also serve as technical advisor to SEMI’s Advanced Packaging initiative and as technical liaison to NextFlex, the Flexible Hybrid Electronics Manufacturing Innovation Institute, awarded to FlexTech in August 2015.
“Dr. Grupen-Shemansky’s experience in the IC industry, specifically with advanced packaging and managing R&D programs, is tremendously valuable to SEMI members,” states Denny McGuirk, president and CEO of SEMI. “With the convergence of technologies and the broadening of microelectronic applications, Melissa will ensure that we are serving our industry’s needs, as well as identifying technology trends and inflections. We are delighted to have someone of her caliber join our team.”
“The FlexTech and NBMC R&D programs are providing the means to help build the FHE supply chain, while bringing multiple stakeholders together to create early stage project demonstrators,” notes Michael Ciesinski, president of the FlexTech Group within SEMI. “Melissa will provide very capable leadership of these programs, contribute to SEMI’s global packaging strategy, and coordinate technology development with NextFlex.”
Starting her career at Motorola in semiconductor research and development, Grupen-Shemansky held various management positions over ten years -- in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration. Following Motorola, she was the director of Interconnect Technology and Design Engineering at Lucent, Bell Labs (Agere Systems), vice president of Packaging and Design at Spansion, and senior vice president of Engineering in Advanced Nanotechnology Solutions, a startup in 3D and cybersecurity.
Grupen-Shemansky has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages. With bachelor and master degrees in Chemical Engineering from Pennsylvania State University, she also holds a Ph.D. in Chemical Engineering from Arizona State University.
"I am very excited to join the SEMI team that, for over 40 years, has provided important business and technical services to the microelectronics supply chain,” notes Dr. Grupen-Shemansky. “The recent addition of FlexTech broadens SEMI’s role to technology development and manufacturing initiatives. To date, the FlexTech Group has enabled and funded essential flexible hybrid electronic innovations and I intend to continue that effort focusing on technology gaps in the ecosystem."
SEMI® connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
FlexTech, a SEMI Strategic Association Partner, is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, by developing solutions for advancing these technologies from R&D to commercialization. Visit FlexTech at www.flextech.org
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