Toshiba Launches Ethernet Bridge Solution For Automotive Applications, Including Infotainment And Telematics
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Toshiba Launches Ethernet Bridge Solution For Automotive Applications, Including Infotainment And Telematics

Chipset enables automotive Ethernet AVB for next-generation IVI and telematics

LAS VEGAS, Jan. 6, 2016 — (PRNewswire) — CONSUMER ELECTRONICS SHOW (CES) --  Toshiba America Electronic Components, Inc. ( TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today introduced an automotive-grade Ethernet bridge solution for in-vehicle infotainment (IVI) and other automotive applications. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav, generally referred to as Ethernet-AVB. The Ethernet-AVB standard enables stable, reliable multimedia transmissions, making it suitable for IVI and telematics.

The new Toshiba TC9560XBG is an automotive-grade Ethernet bridge solution for in-vehicle infotainment and other automotive applications.

Automotive electronics are becoming more complex with the addition of advanced sensors, high-resolution displays, on-vehicle cameras, automated driver assistance systems (ADAS) and their data transmission and controls. Connecting these devices with an industry-standard Ethernet protocol contributes to simplified wiring, cost savings, reduced harness weight and improved mileage. Toshiba's new automotive-grade Ethernet solution also supports Ethernet-AVB, which is an important feature for multimedia applications. In addition, the device will be AEC-Q100[1] qualified to ensure performance in rigorous automotive environments.

Noted Deepak Mithani, senior director of the Mixed-Signal Business Unit, System LSI Group at TAEC, "Working together with our industry collaborators and customers, we have developed a high-value solution specifically intended to meet the growing requirement for automotive Ethernet by making it easier for automotive OEMs to integrate the part into their new vehicles. We look forward to seeing our efforts utilized in upcoming generations of in-vehicle applications."

Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120 million nodes by 2020[2], driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.

Connected to an application processor or other system-on-chip (SoC) host, the TC9560XBG allows the host device to deliver audio, video, and data information through the 10/100/1000 Ethernet network in an automotive environment. Connection to the host is achieved via PCI Express® (PCIe®), HSIC or Time Division Multiplex (TDM)/I2S for audio traffic. The IC's RGMII/RMII[3] interface connects to the Ethernet switch or PHY device, and both AVB and legacy traffic are supported. An on-chip ARM® Cortex®-M3 processor can perform system control and management.

The chipset is housed in a 10x10mm LFBGA package.


Samples of the TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, are available now. Volume production will commence in October 2016.

  1. AEC-Q100 refers to the stress test qualification for ICs established by the U.S.-based Automotive Electronics Council, which sets qualification standards for all electronics components supplied to the automotive industry. Grade 3 refers to ambient operating temperature range of -40°C to +85°C.
  2. "Automotive Ethernet Market Growth Outlook," Strategy Analytics, Oct. 23, 2014.
  3. Fast Ethernet interfaces: RGMII = Reduced Gigabit Media Independent Interface; RMII = Reduced Media Independent Interface. Support is planned for MII (Media Independent Interface).

PCI Express and PCIe are registered trademarks of PCI-SIG. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at

© 2015 Toshiba America Electronic Components, Inc. All rights reserved.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.



Lisa Gillette-Martin

Deborah Chalmers

MCA Public Relations

Toshiba America Electronic Components, Inc.

Tel.: (650) 968-8900, ext. 115

Tel.: (408) 526-2454

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Toshiba America Electronic Components, Inc.