The 55nm LPe process is well suited for high-volume, battery-operated mobile consumer devices as well as a broad range of energy-saving products. Sidense customers are using Sidense 1T-OTP macros at the 55nm LPe process node in clocking, HDMI and NFC chips for several applications, including timing, digital rights management and high-speed communications. The high security, low power and low manufacturing cost of Sidense's SiPROM 1T-OTP memories give designers of silicon products for these applications many advantages when used in place of other NVM such as eFuses and embedded flash memory.
"Demand from our customers for embedded memory in low-power mainstream processes, such as GLOBALFOUNDRIES 55nm LPe, continues to be strong, driven by several market segments within the Smart Connected Universe," said Andrew Faulkner, Senior Director Product Marketing at Sidense. "We have worked closely with GLOBALFOUNDRIES to assure that our common customers are getting highly secure, low power and reliable OTP IP that takes full advantage of the features of the 55nm LPe node."
"Sidense's 1T-OTP non-volatile memory IP is fully qualified on our 55nm LPe process node," said Kevin Yang, Director of Product Management at GLOBALFOUNDRIES. "As a valued IP partner, Sidense continues to provide our customers with an OTP solution that helps them achieve their design goals rapidly and reliably."
SiPROM provides the broadest range of process node coverage -- from 130nm down to 55nm. Densities up to 512 Kbits per macro are available and multiple macros can be used for higher memory capacity, making SiPROM an ideal and field-programmable replacement for masked ROM and, in certain applications, external Flash memory. Designers can choose between four read modes to trade off memory density, read access time, enhanced reliability and enhanced security, and different read modes may be combined in the same macro.
SiPROM macros contain a built-in charge pump, which provides the voltage necessary to program the memory in the field after the chip is packaged. Alternately, programming voltage may be supplied externally through a pad on the chip. SiPROM uses include HDCP encryption keys, analog trim and calibration, boot code and firmware storage, Chip ID, RFID, and other mobile and wireless, medical, and automotive applications.
About the Smart Connected Universe
The Smart Connected Universe is a term at Sidense to describe a collection of market segments that are both Smart (having computational capability) and are connected (typically wirelessly). They share a common set of requirements in cost, power, performance and security. These segments cut across several traditional market segments and include Mobile Computing, IoT, Wearables, Automotive, Medical and Industrial.
About Sidense Corp.
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.
Over 150 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 500 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.
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