August 31, 2015 --
PICLS, an easy to use, real-time, Printed Circuit Board (PCB) thermal analysis tool, facilitates complex PCB heat transfer analyses. PICLS uses an intuitive two-dimensional user interface to model multi-layers PCBs.
Electronics components, which can be created and imported from Cradle ElectronicPartsMaker, generate heat. PICLS models heat sources and sinks, multiple conduction paths, foil layers, and vias connecting the various layers within the board. PICLS performs the PCB heat transfer analysis and calculates the temperature distributions.
Coupling CFD with the PCB model will account for cooling airflow and radiation. PICLS results can be seamlessly imported into Cradle scSTREAM or HeatDesigner CFD software. This efficiently advances the analysis from the component level to the system level.
Click here for more information about PICLS.