New TDA3x processor delivers cost effective ADAS SoC for front, rear and surround view applicationsDETROIT, Oct. 21, 2014 — (PRNewswire) — Convergence -- As governments around the world encourage consumers to buy safer vehicles, automobile manufacturers are striving to build vehicles that consistently achieve higher New Car Assessment Program (NCAP) ratings. Today, Texas Instruments (TI) (NASDAQ: TXN) is introducing the newest member of the automotive system-on-chip (SoC) family, the TDA3x solution. The TDA3x processor family is designed to help car manufacturers develop sophisticated advanced driver assistance systems (ADAS) applications that meet or exceed NCAP requirements, reduce collisions on the road and enable a more autonomous driving experience in entry- to mid-level automobiles. Developed on the same architecture as other TDA devices, the TDA3x offering extends scalability from the TDA2x devices on front camera, surround view and fusion applications with the addition of smart rear camera and radar.
Develop scalable ADAS applications in entry- to mid-level automobiles
Extending TI's highly integrated and scalable family of automotive processors, the TDA3x family supports ADAS algorithms such as lane keep assist, adaptive cruise control, traffic sign recognition, pedestrian and object detection, forward collision warning and back over prevention. These algorithms are critical to the effective use of a broad range of ADAS applications, including front camera, surround view, fusion, radar and smart rear camera. The TDA3x processors will allow customers to develop ADAS applications that address cost-sensitive NCAP programs such as Autonomous Emergency Braking (AEB) for pedestrians and cyclists, Forward Collision Warning (FCW) and Lane Keep Assist (LKA).
Developed on the same architecture as other SoCs in the TDA platform, the new TDA3x processor enables manufacturers to scale product investments delivering a diverse portfolio of products with hardware and software compatibility quickly bringing the next-generation of ADAS features to the road in more affordable cars. The TDA3x SoC is based on a heterogeneous, scalable architecture that includes TI's fixed-and floating-point dual TMS320C66x generation of DSP cores, fully programmable Vision AccelerationPac containing an Embedded Vision Engine (EVE), dual ARM® Cortex®-M4 cores along with an image signal processor (ISP) and a host of peripherals.
The fully programmable TDA3x solution creates additional scalability across the TDA platform for the manufacturer to differentiate and adapt to the fast changing needs of the market. Also, TI Vision SDK software libraries are available which can help customers more easily and quickly develop optimized algorithms for designing ADAS solutions for a broad range of vehicles, from entry to luxury, on the same platform with a reduced level of investment, lower cost and faster time to market.
Industry's first automotive package on package solution
The TDA3x SoC introduces the automotive industry to the first package on package (PoP) including DDR with DDR memory, enabling miniaturization of ADAS cameras or radar systems. Having the capability to mount memory and flash on top of the TDA3x package reduces both the footprint and the board complexity, thus adding processing capability without increasing the size of the module. Multiple memory vendors including Micron, ISSI and Winbond will be providing custom PoP memory for the TDA3x SoC.
ISP integration reducing system cost, complexity and size
By integrating an ISP that enables raw/Bayer sensors, the TDA3x processor delivers improved image quality without increasing the size, cost or complexity of the solution. Variants of the TDA3x SoC have full featured ISP including noise filters, color filter array, video noise temporal filtering (VNTF), exposure and white balance controls, as well as optional support for wide dynamic range (WDR) and lens distortion correction (LDC). The ISP can support a range of combinations for mono, stereo and up to four camera inputs providing an industry leading integrated solution.
Enhanced design for functional safety to help customers develop safer vehicles
TI's TDA3x processors are being developed to meet relevant requirements of the ISO 26262 functional safety standard. The TDA3x processors leverage a wide range of diagnostics from TI's award winning Hercules TMS570 safety MCU family to enhance the existing TDA2x platform safety concept. The combination of hardware, software, tools and support helps TDA3x processor customers develop systems to meet challenging functional safety requirements and achieve system level functional safety certification more efficiently.
PMIC integration delivers highest performance and drives down system size and cost
TI has developed a power management integrated circuit (PMIC) specifically for powering the TDA3x processors, helping customers reduce development time and risk. The PMIC supports the full performance range of the TDA3x solution and includes the power management functions necessary to minimize system-level power consumption. This high-density PMIC also meets the stringent space requirements for ADAS applications and drives system costs down.
Pricing and availability
TI's TDA3x processors are currently sampling and intended for high-volume automotive manufacturers. The TDA3x solution is available in two packages, 15x15 mm and 12x12 mm PoP, and comes complete with a TI Vision SDK, as well as EVE and DSP libraries. Please contact your local TI sales representative for more information.
Visit TI at Convergence
While at Convergence, visit TI at meeting room #321 to learn more about the latest in automotive offerings.
For more information
- Read the TDA3x and Surround View white papers.
- Learn about TI's ADAS offerings and the TDA3x in this technical brief.
- View the POP and ISP Ask the Expert videos.
- Watch the TDA3x video series.
- Keep up with the latest automotive happenings on Behind the Wheel blog.
- Join the TI E2E™ Community.
- Follow TI on Twitter and like TI on Facebook.
Texas Instruments drives automotive innovation
TI's state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market. Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. TI offers SafeTI™ parts designed to facilitate OEMs' compliance with the requirements of ISO 26262, as well as parts specifically designated as compliant with the AEC-Q100 and TS16949 standards, all with excellent product documentation. Visit TI's Automotive page or TI's E2E™ Behind the Wheel Blog to learn more about our commitment to automotive innovation.
About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.
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"The TDA3X SoC is a perfect pairing with our high performance and high sensitivity automotive image sensor, the OV10640, which meets ADAS requirements for camera-based applications with all the right interfaces," said Durga Peddireddy, senior partnership manager, OmniVision. "The TDA3X SoC with its full featured ISP has capabilities to process OmniVision's OV10640 high speed 120dB high dynamic range sensor and various imaging algorithms to provide a crisp view of the scene, leading to best in class performance"
"At KPIT, our commitment is to bring cutting-edge ADAS solutions to our automotive OEM and Tier 1 customers," says Rajesh Janwadkar, vice president, Product Engineering Services, KPIT. "With TI's easy to use programming environment and tools, as well as migration from PC-based software to both embedded vision engine (EVE) and DSP on the TDA3x SoC, we are well positioned to support our customers in developing better products through their current and future vehicle production programs." "KPIT's best-in-class capabilities and excellence in ADAS features development, Optimization, and Porting, along with performance benchmarking & evaluation on TI's TDAx processors and platforms, enables us to deliver consistent value to our customers."
"Micron is excited to offer a package-on-package (PoP) memory solution compatible with TI's TDA3x SoCs to enable automotive customers to create the next-generation of high performance miniaturized ADAS solutions," said Kris Baxter, senior marketing director for Micron's Embedded Business. "PoP memory solutions can enable very small size which is a requirement for many ADAS system and with TI's TDA3x SoC and Micron PoP memory this is now achievable."
"ISSI is pleased to work with one of the preeminent ADAS SoC suppliers in the market. Our partnership on TDA3x SoC PoP solution allows us to work together to provide very cost-effective and miniaturized system solutions," said Lyn Zastrow, vice president, automotive business unit, ISSI.
"Winbond is honored to work with Texas Instruments and its new TDA3x SoC processors for automotive ADAS solutions," says Tung-Yi Chan, president, Winbond Electronics Corporation. "Winbond is now offering new automotive grade memory solutions in Package-on-Package (PoP) that works seamlessly with TI's TDA3x SoC processors."
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SOURCE Texas Instruments
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