Tevet Closes a Strategic Equity Investment; Eurofund Leads Series C Investment in the Semiconductor Metrology Firm

YOKNEA'M, Israel—(BUSINESS WIRE)—June 24, 2004— Tevet Process Control Technologies, a company specializing in advanced metrology solutions for the semiconductor industry, today announced the completion of a $4.5 million strategic equity investment round.

Eurofund and an undisclosed strategic investor led this investment round. Tevet's current investors, including Ofer Brothers Hi-Tech, West Steag Partners, Lewis Trust Group, Ltd., Eurovestech plc, and Goldman Investments participated in the round.

"This investment is a vote of confidence in the company, its technology and its future. Tevet's growth is fueled by our success in capturing multiple Integrated Metrology applications in mass production," said Yuval Wasserman, Tevet's president and CEO. "Our plan is to use this investment to enhance our operational infrastructure in order to meet our commitments to customers, and to expand our investment in new applications and product development."

During the last year Tevet has won strategic design wins and attained process of record status at leading semiconductor manufacturing companies and processing equipment suppliers. Tevet's IsTMS product has demonstrated its unique film thickness measurement and cost-saving capabilities while integrated with commercial single wafer CVD processing tools in production.

"An increasing number of device manufacturers and OEMs have embraced Tevet's advanced process control solutions. As the market continues to adopt sophisticated integrated metrology, we will continue our innovation through the development of critical integrated and in-situ measurement applications," said Ofer Du-Nour, the company's founder, chairman and CTO.

About Tevet-PCT: Founded in 1999 as part of Naiot, the Ofer Hi-Tech incubator, Tevet develops innovative metrology and advanced process control solutions for the semiconductor processing industry. Tevet products are uniquely capable of performing simultaneous film thickness measurements on product wafers with multiple topographies and stacks and in seamless integration with wafer processing equipment. In July 2001 Tevet launched its IsTMS integrated metrology module for CVD applications.



Contact:
Tevet Process Control Technologies
Yuval Wasserman, 925-734-6701

Email Contact
    or
Kirkpatrick Communications, Inc.
Bruce Kirkpatrick, 925-244-9100

Email Contact



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