System Designers Can Now Leverage Industry-leading FPGA-based Products in Conjunction with DO-254 Compliant Design and Re-engineering Solutions for Aerospace Customers and ApplicationsALISO VIEJO, Calif. and SUNNYVALE, Calif., Aug. 12, 2014 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and eInfochips, a leading engineering R&D services company, today announced their collaboration to provide DO-254 compliant design services for the aerospace industry. Companies that build critical avionics systems can take advantage of the immunity to configuration upsets of Microsemi's award-winning FPGA-based products such as SmartFusion2® and IGLOO2®, and can rely on the the leading design practices deployed by eInfochips to improve design efficiency, reliability and performance.
"Many of our aerospace customers are looking for ways to accelerate their product design. They seek reliable partners to supplement their expertise," said Ken O'Neill, director of marketing, space and aviation, at Microsemi. "Through our relationship with eInfochips, our customers can access proven DO-254 design experience for advanced, high performance, avionics systems using our highly reliable, low power FPGAs."
According to market outlook reports from Airbus and Boeing, approximately 1400–1800 new commercial airplanes will be manufactured each year between 2013 and 2032.
The next generation of avionics products aims to improve safety, speed and connectivity for aircraft platforms. Microsemi and eInfochips will positively impact this transition as a part of the global engineering community that designs advanced aerospace systems for critical and non-critical applications.
The industry-leading high reliability of Microsemi's families of FPGA products, arising from the complete absence of radiation-induced configuration upsets, is ideally suited for safety critical applications such as commercial aviation. Microsemi's Flash and antifuse FPGAs have been used in applications requiring DO-254 certification to design assurance level A and B (DAL-A, DAL-B)—the most stringent of safety critical applications in commercial aviation—and have achieved flight heritage on many commercial aircraft programs.
"Our clients strive to achieve reliability for their products, to clear FAA audits with minimal findings," said Parag Mehta, chief marketing and business development officer at eInfochips. "Microsemi's FPGAs, such as the IGLOO2 family, with SEU immune fabric configuration cells, provide the reliability essential for DO-254 compliant systems."
eInfochips' designs are already deployed on many leading global commercial and military aircraft. The company offers expertise on DO-254, DO-178B and DO-160 for product design, re-engineering and sustenance services. The company has hands-on experience with critical products like flight control systems, multi-function displays, navigation systems, communication equipment and cabin management systems, among others. Earlier this year, eInfochips was awarded the 'Global Supplier of the Year' for Engineering and Design Services by the leading aerospace supplier Rockwell Collins.
About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5Gbps transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5Gbps SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry. For more information visit: http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga.
eInfochips is a global product innovation partner recognized for technology leadership by Gartner, Frost & Sullivan, NASSCOM and Zinnov. eInfochips has contributed to 500+ products for top global companies, with more than 10 million deployments across the world.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to Microsemi's and eInfochips collaboration to provide DO-254 compliant design services for the aerospace industry, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
Richard Round, Sr. Manager, Marketing Communications, Microsemi, 949.380.6135
Email Contact or Mayank Shukla, eInfochips, 408.496.1882