Promoting Adoption of Bluetooth® Communication
TOKYO — (BUSINESS WIRE) — September 29, 2013 — Toshiba Corporation (TOKYO:6502) today announced the start of sample shipments of TC35661SBG-700, a Bluetooth® IC for use in small applications, such as thermal sensors, vibration sensors and toys.
Toshiba: "TC35661SBG-700", a Bluetooth(R) IC for use in small applications (Photo: Business Wire)
The new IC integrates a rewritable memory for downloading users custom programs, which are stored in EEPROM. This enables customization without any need for an external microcontroller. The IC promotes adoption of Bluetooth® communication for small applications that do not have wireless functions, due to cost and PCB size restrictions.
The IC incorporates the Bluetooth® Serial Port Profile (SPP) that is widely used for smartphones and other mobile equipment, facilitating development of Bluetooth® compliant applications.
General wireless data communication such as remote control, sensor devices, toy; healthcare; and accessories for smartphone.
Main Specification of the New Product
|Operation Voltage||1.8V or 3.3V|
|Package||TFBGA64, 5mm×5mm, 0.5mm Ball pitch|
|User Memory Size||13KB|
|Corresponding profile||Serial Port Profile|
|Interface||UART, I2C, GPIO|
|Other features||Function to execute user program,GPIO function, Sleep mode, Host wake-up.|
* Bluetooth SIG owns the registered trademark, Toshiba uses it under license.
Mixed Signal IC Sales and Marketing Department
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances.