Altera and TSMC Collaborate on 55 nm EmbFlash Process
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Altera and TSMC Collaborate on 55 nm EmbFlash Process

Altera Plans Next-Generation, Non-Volatile Programmable Devices Targeting High-Volume Applications

San Jose, Calif. and Hsinchu, Taiwan, April 16, 2013 -- Altera Corporation (Nasdaq: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced a technology collaboration using TSMC’s 55nm leading-edge Embedded Flash (EmbFlash) process technology. Programmable devices based on TSMC’s 55nm EmbFlash target a wide range of low-power, high-volume applications in a variety of markets, including automotive and industrial.

Compared to prior generation embedded flash, TSMC’s 55nm EmbFlash delivers faster computing, increases gate density 10 times, and shrinks flash and SRAM cell sizes by 70 percent and 80 percent respectively. Programmable devices from Altera based on TSMC’s 55nm EmbFlash will permit developers of high-volume applications to build feature-rich, non-volatile systems.

“Our relationship with TSMC is built on a shared commitment to delivering the latest technologies and capabilities to customers,” said Reda Razouk, Vice President of Process Technology Development at Altera. “Adding 55nm EmbFlash to our product portfolio extends Altera’s tailored strategy in which Altera optimizes its device families based on process technology, architecture and application-specific IP to meet system requirements.”

“TSMC’s continued investment in technologies such as 55nm EmbFlash broadens opportunities for customers like Altera,” said Jason Chen, TSMC Senior Vice President, Worldwide Sales and Marketing. “By aligning our business and technology goals, Altera can make its customers’ products more competitive.”

About Altera

Altera® programmable solutions enable system and semiconductor companies to rapidly and cost effectively innovate, differentiate and win in their markets. Find out more about Altera's FPGAs, SoCs, CPLDs and ASICs at

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s managed capacity in 2012 totaled 15.1 million (8-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB™ facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 28nm production capabilities. TSMC’s corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit


Lora Ho
Senior Vice President & Chief Financial Officer & Spokesperson 
Tel: 886-3-5054602

Elizabeth Sun
Director, TSMC Corporate Communication Division 
Tel: 886-3-5682085
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