0.13-micron Copper Process Technology Delivers High Density Synchronous SRAMs For Multiple Market ApplicationsSANTA CLARA, Calif.—(BUSINESS WIRE)—March 15, 2004— Alliance Semiconductor Corporation (Nasdaq: ALSC), a leading worldwide provider of analog and mixed signal products, high-performance memory products and systems solutions for the communications, computing, embedded, industrial and consumer markets, today announced the availability of its 36-megabit (36Mb) Synchronous SRAM family. Manufactured using state-of-the-art 0.13-micron copper process technology, Alliance's 36Mb Synchronous SRAMs provide higher densities, lower access latency, and lower power consumption to increase system performance in a variety of applications and end markets including storage systems, wireless infrastructure and networking.
The 36Mb family expands Alliance's growing Synchronous SRAM product portfolio ranging from 2Mb to 36Mb devices and strengthens Alliance's support and commitment to providing its customers with an extensive selection of high-density, high speed and leading-edge memory products for multiple vertical market applications.
"The addition of this 36Mb product family to our portfolio enables Alliance to provide higher density, higher bandwidth memory offerings while maintaining the low latency packet buffering requirements necessary for data storage, networking and embedded applications," said Bhanu Nanduri, vice president and general manager of system solutions for Alliance.
Alliance's 36Mb Synchronous SRAM device configurations include 1Mbx32, 1Mbx36 and 2Mbx18 operating at either 3.3-V or 2.5-V. The devices are user configurable to operate in either pipelined mode or in flow-through mode. In pipelined mode, the devices operate with clock rates up to 250MHz and with clock access times less than 2.6 ns. In flow-through mode the clock access times are less than 6.0 ns. Both pipelined mode and flow-through mode offer active currents of 450 mA and standby currents of 100 mA. Alliance's 36Mb Synchronous SRAM devices support fast clock speeds with no turnaround delay (NTD) or synchronous burst interfaces. In addition, Alliance offers both the 100-lead TQFP and the space saving 165-ball BGA industry standard packaging options.
Samples are available now with production quantities available in the second quarter of 2004. These devices are available in 166 MHz, 200 MHz and 250 MHz with either a synchronous burst or the NTD interface. Pricing starts at $55.00 for 250MHz devices in quantities of 10,000 units.
Alliance Semiconductor Corporation (Nasdaq: ALSC) is powering every application with high performance solutions for the communications, computing and consumer electronics markets. Utilizing advanced process technologies and design expertise, Alliance provides leading OEMs with a broad portfolio of complementary technologies including analog and mixed-signal products, chip-to-chip connectivity products, networking controllers and high-performance memories. Alliance addresses the complete needs of system developers by leveraging its proprietary advances in Electromagnetic Interference (EMI) reduction, power management and timing technology, HyperTransport(TM) I/O connectivity and specialized memory solutions for next-generation applications. Founded in 1985, Alliance is headquartered in Santa Clara, Calif. with design centers in Santa Clara, Bangalore and Hyderabad, India. The company is publicly traded and included in the S&P 600 Index. Additional information is available on the Alliance Web site at: http://www.alsc.com.
Alliance Semiconductor, Santa Clara Robert Napaa, 408-855-4900 Email Contact or Media Contact: Shelton PR Christa Osswald, 972-239-5119 x142 Email Contact