DAC Knowledge Center - April 27, 2010

DAC.com Knowledge Center

Message from the Editor
Looking to the future, closing the design today.    Six more articles are now live at the DAC.com Knowledge Center.   Looking to the future, an interview with Philippe Magarshack of STMicroelectronics examines the coming nexus of multicore architectures and 3D integration; two other articles examine how the electronic design automation field will potentially expand into the realms of bio-design automation and electrical power systems (“smart grids”).   As for closing the design today, three new articles include a technical deep-dive on timing closure methodology in chip physical implementation, a wide-ranging whitepaper on system-level power distribution network design, and a preview from the 2010 DAC User Track on thermal analysis in stacked-die integration. 
 
General topics
By Peter Feldmann, David Kung, Jinjun Xiong  
 
 
back end design topics
By Miroslav Cupak, Herman Oprins, Geert Van, Pol Marchal, Bart Vandevelde, Adi Srinivasan, Edmund Cheng  
 
By Nancy MacDonald  
 
 
DAC highlights

Nexus of Multicore and 3D ICs: The Direction and the Vision

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MP Associates, Inc.




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