18th Si2Con – October 8,
The 18th Si2 Conference will be held on October 8, 2013, at the Network Meeting Center-Techmart in Santa Clara, CA. The Conference will feature speakers and demonstrations from several of the industry’s leading semiconductor and EDA companies. The keynote speaker is Dr. Keith Green, Distinguished Member of the Technical Staff in Analog Technology Development at Texas Instruments, and Chair of the Compact Model Coalition. The complete agenda can be found at:
As Si2 enters its 2nd quarter-century, member companies have discovered and embraced the business value of multiple inter-related standards projects. With the acquisition of the Compact Model Council—the source of important industry-wide SPICE models—the value of Si2’s collaboration model has soared. This conference will explore how these projects stand alone as valuable business propositions, as well as how they work to strengthen each other. Key technical sessions and speakers include:
The Promise of a Universal PDK - Write Once, Use Many:
ST Microelectronics and Intel
Automated Runset Generation - A New Capability for DFM Verification Tools:
IBM and Si2
A New Era of Cooperation in Low-Power Design - System Level Power-Aware Design:
Cadence and aggios
OpenAccess is Easy to Work With Than Ever Before!:
Altera and Si2
SPICE Models Come To Si2:
TI, LSI, and Agilent
Breakfast and lunch are included, as well as a network session after the technical conference. This will showcase demos of advances based on the technologies offered by Si2, and will also serve as a valuable opportunity for networking. Refreshments will be served. Cadence Design Systems is the event sponsor and EDACafe is the media sponsor.
All attendees will also receive an Si2 25th Anniversary polo shirt.
To register on-line:
https://www.si2.org/openeda.si2.org/si2_store/#c1 or use a fax/mail form:
Welcome to John Ellis - New VP Engineering, Si2
Come to the Si2 Conference and welcome John Ellis as the new VP of Engineering at Si2. He replaces Dr. Sumit DasGupta who retired in June after more than 10 years with Si2. John has more than 25 years of experience leading diverse research and development programs spanning multiple industries. For over a decade, he served the semiconductor industry at SEMI, a global trade association for the semiconductor industry, where as VP of Technology he was responsible for semiconductor, photovoltaic, and flat-panel display manufacturing standards as well as coordination of industry initiatives such as e-Diagnostics and 450mm wafer size economic analyses.
Si2 Acquires the Compact Model Council (CMC)
In May, Si2 announced the acquisition of the Compact Model Council (CMC). The CMC, formed in 1996, develops and standardizes compact models of electronic devices used within commercial circuit simulators across the electronics industry,
including virtually all SPICE-class simulation. The CMC will be renamed the Compact Model Coalition to blend with Si2's organizational
structure. The CMC, represented by 37 member companies, supports 20 active subcommittees and has produced over a dozen widely-used
standard device models, modeling API, and SPICE language standard.
The CMC recently released the BSIM6 model, which uses charge conservation to improve accuracy in all regions of operation, and features model symmetry especially useful for analog and RF applications. This model has been extensively tested by CMC members. Standards now in development include models for ET-SOI and GaN FET, and a reliability modeling API. Membership in the CMC is open to all interested parties. For more information see:
http://www.si2.org/?page=1685 . For a video of Dr. Keith Green of Texas Instruments and Chair of the CMC, explaining the transition, see here:
OpenAccess Coalition Adds 6 New Members
Six new members have joined the OpenAccess Coalition (OAC): Calexeda, Fractal Technologies, Lattice Semiconductor, Micron Technologies, PDF Solutions, and Qualcomm. There are currently 38 corporate member companies in the OpenAccess Coalition. OpenAccess Coalition members set the direction on the new features added into the API and the reference database.
The OpenAccess interoperability platform is a standard application programming interface (API) and associated reference database that gives chip designers a common environment for developing and implementing software tools used for integrated circuit (IC) design. For the past decade, many of world’s most complex digital, analog, and mixed signal IC designs have been created using the OpenAccess platform. Additional information
on the OAC can be found here:
DAC Booth Presentations Now Available
At this years Design Automation Conference (DAC), Si2 completely revamped the way we inform the industry of our standards development activities. In the newly-designed booth area, member companies gave a series of presentations covering such items as: Open Process Specification, OpenDFM, Silicon Photonics, Open Parasitic Exchange, OpenAccess Scripting, OpenPDK Tool Interfaces, Low-Power Design, and many others. The presentations, and a picture of the new Si2 booth, can be found here:
EDA Goes Back the Future, Oct 16. You’re invited!
The EDA Consortium will host an industry reunion on October 16 at the Computer History Museum in Mountain View, Calif. You are invited to join with luminaries and alumni to celebrate our industry’s rich history, look to the future, connect with old friends and make new ones. The event features an auction to benefit the EDA Oral Histories Collection and Exhibit underway at the museum. Auction lots include luxury time-shares, private reserve wines and lunch with your favorite CEOs. Donations are tax deductible. EDAC also welcomes everyone to share memories and photos online by signing their EDA Yearbook. It is a really cool way to celebrate our industry and remember special times with colleagues and friends. Tickets are $200 for members./$175 for non-members. Group tickets are available.
Find out more and reserve your seat:
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