Social Media Platform Announces SpringSoft’s Participation

SILICON VALLEY, Calif. — (BUSINESS WIRE) — April 21, 2011 —, a worldwide social media platform facilitating mass communication among semiconductor design professionals using Web 2.0 collaboration technologies today announced that SpringSoft Inc., a leader in verification solutions and custom layout solutions will participate in the site. has been live since the start of 2011 and can be reached at

“Our industry needs a site that facilitates real-time, vendor-neutral discussion from actual users,” said Daniel Nenni, founder of “ provides our users with an collaborative community to promote the open exchange of ideas and experience.”

“SpringSoft has been looking for more interactive channels to reach its users and potential users in this new more collaborative era,” said Rob van Blommestein, director of corporate communications of SpringSoft. “ drives open discussion on the semiconductor industry, design experiences, IP and methodologies. I invite everyone involved with design to register, most especially, of course, our own users.”

Daniel Nenni is joined at by industry bloggers Paul McLellan, Daniel Payne, Eric Esteve and Steve Moran who blog on all aspects of the semiconductor and EDA industries and moderate the site.

Paul McLellan, 408-799-3597
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