MIPS Technologies and Tensilica Team to Accelerate SOC Design Activity on Android(TM) Platform; Plan Joint Demos at CES

SUNNYVALE, CA and SANTA CLARA, CA -- (MARKET WIRE) -- Dec 17, 2009 -- MIPS Technologies, Inc. (NASDAQ: MIPS) and Tensilica® Inc. today announced they are working together to accelerate SOC (system-on-chip) design activity on the popular Android™ platform. Together, MIPS and Tensilica will help companies speed the design of new home entertainment and mobile consumer products based on Android. A joint demo of a MIPS32® processor core integrated with Tensilica's HiFi 2 Audio DSP will be on display in suites that both companies have at the Consumer Electronics Show (CES) in Las Vegas, January 7-10, 2010.

"As we continue to push Android into a broad range of consumer electronic products, we are building a complete partner infrastructure to offer a total MIPS-Based Android solution to designers of next-generation connected devices," stated Art Swift, vice president of marketing for MIPS Technologies. "Tensilica's HiFi 2 Audio DSP is an ideal audio processor because it is proven in millions of consumer devices, has low power consumption, and comes with a comprehensive library of over 60 audio codecs for just about any standard from simple MP3 to Dolby® and DTS, plus a full suite of partner solutions for audio post processing."

"We are impressed with the roadmap MIPS Technologies has put together for Android and its vision that will enable a new generation of connected multimedia devices," stated Mahesh Venkatraman, vice president of marketing, vertical segments, for Tensilica. "By working with MIPS, we can provide chip designers with a proven high-quality audio solution that will span connected devices ranging from mobile wireless phones to low-cost digital picture frames, high-definition DTVs, set-top boxes, Blu-ray disc players and more."

MIPS Technologies will display the jointly developed technology at CES in its suite at the Las Vegas Hilton. To schedule an appointment to see the demo, please contact Email Contact.

Tensilica will display the jointly developed technology at CES in its suite in the South Hall of the Las Vegas Convention Center, suite South 4 35567MP. To schedule an appointment to see the demo, please contact Email Contact.

About Android on MIPS

Leveraging its leadership position in the digital home, MIPS Technologies is spearheading efforts to make Android a reality for a wide range of consumer electronic devices. With Android and the dynamic open source development community around it, developers can easily and quickly create new applications, and OEMs can leverage a fast-growing set of applications for their devices. The MIPS® ecosystem around Android enables OEMs to quickly optimize Android for their specific platforms and debug their solutions across the entire software stack. For more information about the Android platform and MIPS, or to access the full source code for MIPS Technologies' port of Android to the MIPS32® architecture, including a reference binary and documentation, please visit www.mips.com/android or email Email Contact.

About HiFi 2 Audio from Tensilica

Today's audio requirements range from low-power MP3 playback to high-performance home-theater multi-channel playback of recorded media. Tensilica's HiFi 2 Audio DSP is the only audio core that covers the complete range. That's why five of the top 10 semiconductor companies have picked Tensilica's HiFi 2 Audio DSP for their products. For more information, see www.tensilica.com/products/audio.htm.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (NASDAQ: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

About Tensilica

Tensilica, Inc. -- the leader in customizable dataplane processors -- is a semiconductor IP licensor recognized by the Gartner Group as the fastest growing semiconductor IP supplier in 2008. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-to-100-times the performance because they can be customized using Tensilica's automated design tools to meet specific dataplane performance targets. Tensilica's DPUs power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Editors' Notes:

Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. MIPS, MIPS32, 1004K and MIPS-Based are trademarks or registered trademarks in the United States and other countries of MIPS Technologies, Inc. Dolby is a registered trademark of Dolby Laboratories. Android is a trademark of Google, Inc. Use of this trademark is subject to Google Permissions. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

Press Contacts:

Paula Jones
(408) 327-7343

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Erika Powelson
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Jen Bernier
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