Tensilica Announces Strategic Investment by DOCOMO Capital

SANTA CLARA, CA -- (MARKET WIRE) -- Jun 22, 2009 -- Tensilica®, Inc. today announced that DOCOMO Capital, Inc. has made a strategic investment in Tensilica. DOCOMO Capital is the corporate venture arm of NTT DOCOMO, Japan's leading wireless carrier. Tensilica is a major semiconductor IP (intellectual property) supplier specializing in dataplane processor cores, which are a combination of CPU (central processing unit) and DSP (digital signal processor) that can be rapidly customized to provide 10-100x the performance of standard CPUs and DSPs. Tensilica's DPUs (dataplane processing units) are widely used in system-on-chip (SoC) designs for mobile consumer devices.

"We recognize the growing importance of Tensilica's customizable DPUs for semiconductors that enable lower power and innovative mobile devices, and that's why we made this investment," stated Tomoya Hemmi, president and CEO, DOCOMO Capital. "Tensilica's high-performance DPUs for audio, video and baseband functions will be key enablers for new capabilities and increased battery life in future mobile telephones."

"NTT DOCOMO is well respected for its deep involvement in the holistic design of its mobile networks, down to the algorithms, semiconductors and systems technology employed in the handsets. We are excited about our new, closer relationship with this tech savvy carrier and work with them to drive new technology and the early deployment of new standards," stated Jack Guedj, Tensilica's president and CEO. "We are also pleased that our major capital investors -- Foundation Capital, Meritech Capital Partners, Oak Investment Partners and Worldview Technology Partners -- participated along with DOCOMO Capital in this financing round."

Tensilica, Inc. is a privately held company. The Gartner Group, in its March 2009 report on the semiconductor IP market, recognized Tensilica as the fastest-growing semiconductor IP supplier.

About DOCOMO Capital

DOCOMO Capital, Inc. is a wholly owned U.S. subsidiary of NTT DOCOMO, INC. (NYSE: DCM), the leading wireless network operator based in Japan. Working closely with NTT DOCOMO's business and R&D divisions, DOCOMO Capital is in charge of NTT DOCOMO's strategic investments in mobile communications related start-up companies mainly in the United States. For more information, visit www.docomo-capital.com.

About Tensilica

Tensilica, Inc. -- the leader in customizable dataplane processors -- is a semiconductor IP licensor recognized by the Gartner Group as the fastest growing semiconductor IP supplier in 2008. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-to-100-times the performance because they can be customized using Tensilica's automated design tools to meet specific dataplane performance targets. Tensilica's DPUs power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Editors' Notes:

--  Tensilica and Xtensa are registered trademarks belonging to Tensilica
    Inc. All other company and product names mentioned are trademarks and/or
    registered trademarks of their respective owners.
--  Tensilica's announced licensees include:  ADDMM, Afa Technologies,
    ALPS,  Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay
    Microsystems, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant
    Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM
    Microdevices, Fujitsu Ltd., Fujitsu Microelectronics Ltd., Hudson Soft,
    iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks, LG
    Electronics, Lucid Information Technology, Marvell,  NEC Laboratories
    America, NEC Corporation, Neterion, Nethra Imaging, Nippon Telegraph and
    Telephone Corporation (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,
    Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies,
    PowerLayer Microsystems, Samsung, SiBEAM, Sony, STMicroelectronics,
    Stretch, TranSwitch Corporation, Triductor Technology, UpZide, Valens
    Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, and
    XM Radio.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Press Contacts:

Paula Jones
(408) 327-7343

Email Contact

Erika Powelson
(831) 424-1811

Email Contact

Review Article Be the first to review this article
Downstream : Solutuions for Post processing PCB Designs

Featured Video
Applications Engineer for intersil at Palm Bay, Florida
Principle Electronic Design Engr for Cypress Semiconductor at San Jose, California
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Design Verification Engineer for intersil at Morrisville, North Carolina
Upcoming Events
NVIDIA’s GPU Technology Conference (GTC) at San Jose McEnery Convention Center 150 West San Carlos Street San Jose CA - Mar 26 - 29, 2018
ESC Conference Boston at boston MA - Apr 18 - 19, 2018
IEEE Women in Engineering International Leadership Conference at 150 W San Carlos St San Jose CA - May 21 - 22, 2018
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: UltraPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise