Ansoft to Introduce High-Performance Computing Capability for HFSS at International Microwave Symposium

SOUTHPOINTE, Pa. — (BUSINESS WIRE) — May 26, 2009 ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced that its subsidiary Ansoft will showcase leading electronics solutions at the International Microwave Symposium (IMS) conference to be held in June. As wireless communication and electronic devices proliferate and become smaller and more functional, the need for robust simulation solutions increases. Ansoft™ software helps engineers design, simulate and validate the behavior of complex high-performance radio frequency (RF), microwave and millimeter-wave devices in next-generation wireless communication and defense systems. Using Ansoft technology, customers can achieve a dramatic reduction in development time and cost, while at the same time realize increased reliability and optimization.

IMS is the world's premier RF/microwave engineering conference, dedicated to the advancement of microwave theory and its applications. During the event, Ansoft will introduce planned enhancements to its industry-standard 3-D full wave electromagnetic field simulation software HFSS™, including domain decomposition, a high-performance computing (HPC) option. The technology, which adds even more depth and breadth to the ANSYS multiphysics suite, enables engineers to solve problems such as electromagnetic-induced heating in high-power microwave structures and antenna performance while under mechanical deformation through links with the ANSYS® Workbench™ platform.

“This year, RF and microwave engineers will discover how our new high-performance computing breakthroughs and multiphysics solutions can deliver remarkable advantages,” said Dr. Lawrence Williams, Ansoft's director of product management. “These advancements will allow engineers designing devices such as antennas, phased arrays, passive RF/mW components, advanced electronic packaging, and RF PCBs the ability to consider many more design possibilities and to solve very large-scale problems faster than ever before. It is another important step in delivering the ANSYS vision of Simulation Driven Product Development™.”

Ansoft will stage in-booth demonstrations during the conference. Ansoft’s advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation can break the cycle of repeated design iterations and lengthy physical prototyping.

Ansoft will be at booth 2207 at the IMS conference, which takes place June 7 to 12 in Boston, Massachusetts, U.S.A.

About ANSYS, Inc.

ANSYS, Inc., founded in 1970, develops and globally markets engineering simulation software and technologies widely used by engineers and designers across a broad spectrum of industries. The Company focuses on the development of open and flexible solutions that enable users to analyze designs directly on the desktop, providing a common platform for fast, efficient and cost-conscious product development, from design concept to final-stage testing and validation. The Company and its global network of channel partners provide sales, support and training for customers. Headquartered in Canonsburg, Pennsylvania, U.S.A., with more than 60 strategic sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ approximately 1,700 people and distribute ANSYS products through a network of channel partners in over 40 countries. Visit www.ansys.com for more information.

ANSYS, ANSYS Workbench, Ansoft, AUTODYN, CFX, FLUENT, and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.



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