IEC Applauds Notable Industry Contributions with Announcement of 2009 DesignCon Paper Award Winners
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IEC Applauds Notable Industry Contributions with Announcement of 2009 DesignCon Paper Award Winners

The International Engineering Consortium (IEC) honors the authors of the best papers in semiconductor and electronic design presented in the technical program at DesignCon 2009

CHICAGO – March 2, 2009 – The International Engineering Consortium (IEC) today announced the winners of the 2009 DesignCon Paper Awards recognizing outstanding contributions to the educational goals of the DesignCon program. Papers are judged both on the merits of the written document and on the quality of their presentation at DesignCon events.

“The caliber of this year’s technical program illustrates great strides in the industry and we’re pleased to honor the most outstanding contributions with the 2009 DesignCon Paper Awards,” commented IEC Content Director Dr. Barry Sullivan. “We would like to thank all those that participated, especially the Technical Program Committee, for lending their insight and expertise to this high-quality event.”

The winners were chosen from among the 2009 finalists selected by a panel of judges comprised from members of the DesignCon 2009 Technical Program Committee, 129 of the industry's top thought leaders that develop the exceptional educational program. This year’s event featured the largest technical program ever with nearly 100 paper presentations.

The 2009 DesignCon Paper Award winners include the following authors and papers in their respective categories:

Chip-Level Design

Board and System Design

High-Speed and RF Design

Interconnect Design

Power Integrity and Power-Aware Design

Test and Measurement

The 2009 Paper Award winners will be presented during the inaugural DesignCon Awards Gala giving tribute to the achievements of the most prominent visionaries in the electronic design and semiconductor industry at DesignCon 2010 in Santa Clara.

For information on sponsorship opportunities for the evening gala at DesignCon 2010 contact Christine Paplaczyk at Email Contact or +1-312-559-4616. Table reservations will open online closer to the event.

Visit www.designcon.com/2009/ for full information or contact Katie Post at Email Contact or +1-312-559-3658.

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About DesignCon 2009
Taking place annually in Silicon Valley, DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues in the industry, DesignCon 2009 hosted more than 120 exhibiting companies and drew approximately 5,000 industry professionals to register. This year, with more than 125 sessions and tutorials and more than 350 industry leaders speaking, DesignCon 2009 hosted the largest technical program in its history. DesignCon 2009 also premiered the IP Summit, a special featured program of the conference and exhibition.
Visit www.designcon.com/2009.

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.