IEC’s DesignCon 2009 Breaks Pre-Registration Record and Prepares Largest Technical Program Ever

CHICAGO—(BUSINESS WIRE)—January 6, 2009— Themed the brightest minds in electronic design, DesignCon 2009 will gather more than 350 experts to present more than 125 paper presentations, tutorials, technical panels, business forum panels, keynotes, and sessions over four days this February 2-5 at the Santa Clara Convention Center.

DesignCon 2009 will once again serve electronic design experts spanning chip, package, board, and system domains, addressing common issues in signal integrity, power management, interconnection, and design verification.

The extensive educational program complements a two-day, cutting-edge exhibition which will feature hundreds of electronic design tools and measurement solutions.

[Photo: www.designcon.com/2008/gallery/tuesday/bg_14.jpg]

Hundreds of industry professionals listen intently to DesignCon keynoters every year in the Main Theater at the Santa Clara Convention Center to learn of industry trends, design solutions and more

“In a time when the semiconductor industry and other high-technology industries are impacted by the global economy, and in a time when companies are reducing business travel and tradeshow participation across the board, I’m pleased that IEC events like DesignCon are meetings they definitely cannot afford to miss,” commented IEC President John Janowiak.

“Our record-breaking number of pre-registered attendees is a testament to the outstanding value DesignCon offers as well as the unsurpassed networking opportunities available both in the sessions and on the exhibition floor.”

[Photo: www.designcon.com/2008/gallery/wednesday/bg_4.jpg]

Thousands of industry professionals swarm the DesignCon exhibition floor every year to benefit from design solutions presented by leading semiconductor companies

DesignCon 2009 will also present its first-ever IP Summit, a special featured program, assisting professionals who rely on semiconductor IP to deliver complex designs in a timely manner. Attendees can benefit from the IP Summit offerings both in the conference program and technology exhibition.

Major sponsors of the event include Official Host Sponsor Agilent Technologies; IP Summit Sponsor Denali Software; Corporate Partner Rambus; Diamond Sponsors LeCroy Corporation and Tektronix; Platinum Sponsor Mentor Graphics; Gold Sponsor BERTScope; Corporate Registration Sponsors Bayside Design Inc (BDI) and Cisco; and more.

All industry professionals are invited to register at www.designcon.com/2009/register/.

Visit www.designcon.com/2009 or contact Katie Post at Email Contact or +1-312-559-3658.



Contact:

International Engineering Consortium
Katie Post
+1-312-559-3658
Email Contact
www.designcon.com/2009




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