Physware Introduces PhysPack-S High-Speed, High-Capacity, 3D Full-Wave Electromagnetic Solution for Signal Integrity in Package and Board Design

SANTA CLARA, Calif.—(BUSINESS WIRE)—February 1, 2008— Physware, Inc., a provider of high-speed, 3D field solutions for the high-frequency package and board markets, today introduced PhysPack-S, a fully automated, high-speed, high-capacity, three-dimensional full-wave electromagnetic (EM) analysis solution for signal integrity.

"The constant trend towards higher levels of integration and faster data exchange rates in all semiconductor markets has placed tremendous pressure on package designers to provide compact, high-performance solutions. Our customers have told us that existing chip-centric and board-centric analysis solutions do not provide the accuracy and speed needed for meaningful package design insights," said Dr. Feng Ling, Physware Vice President of Engineering. "They clearly need a package-centric, high-throughput analysis solution that rigorously accounts for a broad spectrum of physics from low-frequency inductance variation to high-frequency radiation. PhysPack-S has been designed from the ground up to provide a highly automated, scalable analysis solution to fill that need," he added.

PhysPack-S supports industry-standard input and output formats and features automated port setup, automated and layered transparent mesh generation and automated boundary conditions. Based on innovative integral equation methods that employ finely tuned order-N fast hierarchical algorithms and advanced pre-conditioning methods, PhysPack-S is scalable to meet the needs of any level of complexity in analysis. PhysPack-S's multi-threaded architecture accommodates hybrid distributed-shared memory computing systems, providing significant speed up through multiple cores and/or CPUs.

PhysPack-S is currently in beta release with select customers world-wide. General availability of PhysPack-S is scheduled for Q1 2008. PhysPack-S supports Windows and Linux OS. For additional information and a demo of the product, visit Physware at Booth #225 at the DesignCon 2008 tradeshow exhibition being held on February 5, 2008 and February 6, 2008 at the Santa Clara Convention Center, Santa Clara, California, or contact directly at physpack@physware.com or 800-686-5213.

About Physware

Physware, Inc. develops high-speed field solutions for signal and power issues in high-frequency package and board-level electrical modeling and design for the microelectronics industry. The company's patent-pending, physics-aware technology tightly couples analysis and design methods to the underlying Maxwell's and circuit equations, enabling robustness and efficiency at every step of the design cycle and significantly reducing time to market. Physware's accelerated technology delivers unprecedented capacity, handling in package and board simulations, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy.

Physware is a venture-backed, privately held company led by an experienced management and advisory team. The technology is based on multiple patent-pending methodologies, over one hundred publications and several Ph.D. theses. For additional information, please visit www.physware.com.

Contact:

Physware, Inc.
Bala Vishwanath, 425-458-0597
Email Contact


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