"The integration of Optimal into Apache has been a great success, already exceeding our expectations," said Dave DeMaria, senior vice president of Chip-Package-System at Apache (former CEO of Optimal). "We shared our vision and roadmap for an industry-first co-design solution with our customers and received an exceptionally positive response. In addition to the teams successfully integrating, we've added more resources to accelerate our roadmap, and we exceeded our bookings goal in Q4, all in our first quarter as part of Apache."
"We made significant strides helping our customers address the power and noise challenges for chip, package, and system in 2007. We expanded our traditional SoC dynamic power customer base and once again achieved a record quarter in Apache's organic business," said Andrew Yang, CEO of Apache. "In addition, Apache moved to a new headquarters in San Jose, California to accommodate our growth."
RedHawk is a full-chip Vectorless Dynamic(TM) power integrity solution for power closure sign-off of nanometer SoC designs. RedHawk addresses dynamic power issues such as simultaneous switching output (SSO) for core, memory, clock, and I/O, as well as effects of on-chip inductance, package RLC, and decoupling capacitance. With RedHawk, designers can identify dynamic "hot spots," examine its impact on timing, accurately pinpoint the cause of dynamic voltage drop, and automatically repair the source of supply noise. RedHawk enables designers to reach power closure sign-off for high performance SoCs, including those utilizing ultra-low-power design techniques such MTCMOS (power-gating), substrate back-biasing, and on-chip LDO voltage regulators.
Sentinel is industry's first combined chip-package-system (CPS) power and I/O integrity solution. It combines chip's core switching power delivery network, I/O sub-system, and package / PCB models in a single environment for accurate CPS co-design from early prototyping to signoff. Sentinel includes compact, Spice-compatible chip power model (CPM) including LC resonance and a complete line of package power and signal integrity analysis tools for optimal pad/package selection.
About Apache Design Solutions
Apache delivers the leading power signoff solution adopted by 80% of the top IDM, fabless semiconductor, and foundries and a complete platform for silicon integrity of low-power, high-performance system-on-a-chip (SoC) designs. Apache's innovative platform considers multiple noise sources that impact the design--such as power, signal, package / system IO, substrate, and temperature--and enables designers to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon and/or system. Apache's vendor-neutral solution supports any industry-standard physical design flow and is certified by TSMC and Common Platform Reference Flows. Apache is a global company with R&D centers and direct sales / support offices worldwide. For more information, visit www.apache-da.com.
Apache Design Solutions, NSPICE, RedHawk, PakSI-E, PsiWinder, Sahara, Sentinel, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.