Apache Design Solutions and Optimal Corporation to Present Technical Webinar on IC-Package Co-Design for Power Integrity

MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—October 4, 2007— Apache Design Solutions, the technology leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC), analog, and system designs, today announced that it will partner with Optimal Corporation, a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design, to present a free online technical webinar that will explore the symmetrical use of package-aware chip analysis and chip-aware package analysis to address true IC-Package co-design.
WHO:     Apache Design Solutions and Optimal Corporation

WHAT:    An educational webinar detailing the methodology and
         technology for integrated IC-Package co-design.

WHERE:   TechOnline -
         http://www.techonline.com/learning/webinar/202102857

WHEN:    10:00 a.m. PDT, 1:00 p.m. EDT,
         Tuesday, October 9, 2007


Specifically, this live webinar will discuss:

-- Impact of package on chip power integrity

-- Methodology for power analysis with consideration of package impact

-- Technology for generating core power delivery network model

-- Use of chip power model in package design

About Apache Design Solutions

Apache delivers the leading power sign-off solution adopted by 80% of top IDMs, fabless semiconductor companies, and foundries, as well as complete platform solution for silicon integrity of SoC, analog-IP, and system designs. Apache's innovative platform considers all sources of noise that impacts the design--such as power, signal, package / system I/O, substrate, and temperature--Apache's silicon integrity platform enables designers of leading networking, wireless, communication, consumer, and semiconductor companies to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon / system. Apache's vendor-neutral solutions enable designers to adopt any industry-standard physical design flow and are in production use by over 40 customers worldwide. For more information, visit www.apache-da.com.

About Optimal Corporation

Optimal Corporation is a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Its innovative solutions enable design teams to concurrently analyze and optimize the IC with the package and the packaged IC on the PCB. Through seamless integration with all of the major CAD design flows, its solutions help customers achieve fast and efficient design time. Optimal, founded in 1995, is a TSMC Technology Alliance Partner and a member of the Apache Design Automation Partners Program. Optimal Corporation is headquartered in San Jose, Calif. For more information, visit: www.optimalcorp.com.

Contact:

Apache Design Solutions
Yukari Ohno, 650-641-4200
Email Contact
or
Public Relations for Apache
Cayenne Communication
Michelle Clancy, 252-940-0981
Email Contact




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