Nascentric Closes $7.2M Investment Round with Intel Capital and Austin Ventures

SAN JOSE, Calif.—(BUSINESS WIRE)—September 12, 2007— Nascentric, Inc. an Electronic Design Automation (EDA) company focused on providing innovative Fast-SPICE simulation and analysis tools, announced today that it has closed a $7.2 million Series C financing, including new investor Intel Capital. Existing investors Austin Ventures, Silverton Partners, Needham Capital and EDA veteran Jim Solomon also participated.

"Nascentric has developed a novel technology to meet the growing challenges of sub-65 nanometer process node design verification," said Sean Doyle, director at Intel Capital. "We believe Nascentric will continue to make noteworthy contributions to next generation design verification methodology."

As feature sizes in integrated circuits (ICs) continue to shrink, parasitic capacitances and leakage currents have come to dominate the design and verification process. The Nascentric solution, AuSIM MT, is based on several technology innovations including current-based SPICE simulation models and multi-threaded simulation capabilities to deliver unmatched speed, capacity and accuracy for design verification.

"This funding round will enable us to expand our product capabilities as well as expand our worldwide sales and support capability," said Rahm Shastry, president and CEO of Nascentric. "We are encouraged that Intel Capital chose to invest in us after an evaluation of our technology and team."

About Nascentric

Nascentric is a privately held company that develops and markets a patented, next-generation Fast-SPICE simulator for analysis and functional verification of complex nanometer designs. Nascentric products allow designers to quickly simulate, analyze and verify larger and more complex circuits, improve design quality, and facilitate higher yields. The Nascentric management team brings decades of combined electrical engineering and electronic design automation experience to bear on the challenge of delivering full-chip simulation and analysis focused on eliminating silicon re-spins due to nanometer effects. For more information call 1-512-225-8800, or visit us on the web at www.nascentric.com.

About Intel Capital

Intel Capital, Intel's global investment organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software and services targeting enterprise, home, mobility, health, consumer Internet and semiconductor manufacturing. Since 1991, Intel Capital has invested more than US$6 billion in approximately 1,000 companies in more than 40 countries. In that timeframe, about 157 portfolio companies have gone public on various exchanges around the world and another 187 have been acquired by other companies. In 2006, Intel Capital invested about US$1.07 billion in 163 deals with approximately 60 percent of funds (excluding Clearwire) invested outside the United States. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

Nascentric, the Nascentric logo, and AuSIM are trademarks and registered trademarks of Nascentric, Inc. All other company or product names are the registered trademarks or trademarks of their respective owners.

Contact:

Nascentric, Inc
Dino Caporossi, +1-408-499-2948
Email Contact


Rating:


Review Article Be the first to review this article


Editorial
More Editorial  
Jobs
Sr. Field Applications Engineer, CA for Real Intent at Sunnyvale, or San Diego, CA
Applications and Technical Marketing Engineer for E-System Design, Inc. at San Jose, CA
SW Developer Custom Placement P&R for EDA Careers at San Jose, CA
Sr. EDA Account Manager for EDA Careers at San Jose, CA
***JAVA CAD/SW Engineer*** for EDA Careers at San Jose, CA
Upcoming Events
SEMICON Japan 2014 - Dec. 3 - 5, 2014 - Tokyo Big Sight, Tokyo, Japan at Tokyo Big Sight 3 Chome-11 Ariake Tokyo Japan - Dec 3 - 5, 2014
3D ASIP Conference at The Hyatt Regency San Francisco Airport 1333 Bayshore Highway Burlingame CA - Dec 10 - 12, 2014
IEEE Electrical Design of Advanced Packaging & Systems Symposium. Dec 14 - 16, 2014 in India at World Trade Centre Brigate Gateway, Malleswaram West, Bangalore India - Dec 14 - 16, 2014
2015 European 3D TSV Summit January 19-21, 2015 Grenoble (France) at MINATEC innovation campus 3 parvis Louis NĂ©el Grenoble France - Jan 19 - 21, 2015
Senior Software Engineer



Click here for Internet Business Systems © 2014 Internet Business Systems, Inc.
595 Millich Dr., Suite 210, Campbell, CA 95008
+1 (408) 850-9202 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and EngineeringTechJobsCafe - Technical Jobs and ResumesGISCafe - Geographical Information Services	MCADCafe - Mechanical Design and EngineeringShareCG  - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy