Clear Shape's InShape in TSMC's Reference Flow 8.0 and DFM Data Kit (DDK)

InShape qualifies for TSMC's 45nm technology and is included in Reference Flow 8.0

SANTA CLARA, Calif., June 27 /PRNewswire/ -- Clear Shape Technologies, Inc., a leader in variability analysis and optimization solutions, announced today that Taiwan Semiconductor Manufacturing Company (NYSE: TSM), has qualified InShape for 45nm process technology and included it in Reference Flow 8.0.

 

TSMC has very stringent criteria to qualify layout printability checking tools used to ensure printability of nanometer designs. Clear Shape's InShape was qualified for 65nm and 55nm nodes in 2006 and now 45nm. In addition to this qualification, it was also included in Reference Flow 8.0 as a lithography analysis tool to enable litho-aware routing.

"DFM analysis is critical to advanced technologies and our customers benefit by implementing highly printable layouts," said Kuo Wu, deputy director of design service marketing at TSMC. "Based on TSMC's Active Accuracy Assurance Initiative, we worked with Clear Shape to ensure that their models are silicon-accurate for each process node. We have now qualified InShape for all layers for 45nm technology and included it in our Reference Flow 8.0 to deliver litho-aware routing to our customers," he added.

"This is a significant step in our partnership with the world's leading foundry," said Atul Sharan, President and CEO of Clear Shape. "We have worked with TSMC to qualify silicon-accuracy and full-chip performance of our tools to adhere to their high standards to preserve accuracy for every process node. Now our mutual customers can leverage the reference flow and start designing 45nm chips," he concluded.

About Clear Shape

Clear Shape Technologies, Inc. is focused on delivering a complete Variability Platform that allows designers to control and optimize the parametric and catastrophic impact of systematic manufacturing variations. Clear Shape products are targeted to cell-based, custom analog, IP, and library designers using sub-90 nm processes. Clear Shape's products utilize innovative, patented model-based technology which contains secure fab data to capture RET, OPC, CMP, mask, etch and lithography effects on both device and interconnect. Clear Shape's products are in the DFM qualification programs of all three major foundry platforms. Clear Shape is backed by top-tier venture investors that include USVP, Intel Capital and KT Ventures (KLA Tencor). The company is headquartered at 3255-3 Scott Blvd, Suite 102 Santa Clara, Calif. 95054. For more information, visit http://www.clearshape.com or call +1 (408) 833-7130.

Web site: http://www.clearshape.com/




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