CHICAGO—(BUSINESS WIRE)—January 17, 2007— The International Engineering Consortium (IEC) hosts a record-breaking number of exhibitors at DesignCon 2007, which takes place this January 29 through February 1 at the Santa Clara Convention Center in Santa Clara, CA.
IEC President John Janowiak commented, "Our growing exhibition
floor once again has a record-breaking number of exhibitors with an
added group of exciting new companies. And dedicated to continuing
education, we are thrilled to present the Exhibits Plus Pass to all
industry professionals, which grants full and complimentary access to
the entire exhibition, keynote addresses, along with plenary and
technical panels and receptions."
Major sponsors exhibiting at DesignCon include Agilent
Technologies (Official Sponsor), RAMBUS, Inc., LeCroy Corporation,
Tektronix, Inc., BERTScope, Computer Simulation Technology, Sigrity,
Inc., ANSOFT Corporation, Molex, MOSAID Technologies, Samtec and REED
The DesignCon exhibition features leading organizations presenting
EDA tools, test and measurement equipment, PCBs and related
technologies, semiconductor components and IP, interconnect
technologies and more.
Exciting new companies joining the DesignCon exhibition include:
Accurel Systems, Anritsu Company, ANSYS, Inc., Appro, Arch Pro Design
Automation, Inc., ASSET InterTech, Inc., Bogatin Enterprises, CA
Design, Carbon Design Systems, Cascade Microtech, ChipEDA, Chip
Estimate, Coretec, Corning Gilbert, Inc., Coverity, DuPont Electronic
Technologies, Flomerics, Inc., FuturePlus Systems, Innov-x Systems,
Inc., Memcore Inc., Merix Corporation, Mixel, NCI Logic Analyzers, NEL
Frequency Controls, Nicomatic, Noise Com, Oak-Mitsui Technologies,
Paricon Technologies Corporation, Perfectus Technology, Rosenberger of
North America, LLC, San Francisco Circuits, Semiconductor
Store/Symmetry Electronics, Simberian, Inc., Solarflare
Communications, Inc., Springer Science + Business Media, LLC, Starnet
and TES Electronic Solutions.
The DesignCon exhibition also features three Technology Pavilions
this year providing attendees with hands-on demonstrations in specific
technology areas including semiconductor and IP, PCB and verification.
Also on the floor are the DesignCon Poster Sessions, which will be
presented by industry authors during the Exhibition Floor Evening
Reception on Tuesday and Wednesday. Poster topics include 3D-packaging
technologies, advanced interconnect technologies, system-in-package
(SiP) design and wafer-level testing.
The TecPreview theatre takes the stage previewing some of the
latest industry advancements using multimedia. Presenters include
BERTScope, CA Design, eASIC, FuturePlus Systems, LeCroy Corporation,
NEL Frequency Controls, Inc., Samtec, Synplicity, Inc. and Tektronix,
Inc. More information on TecPreviews can be found at
The annual DesignTOUR also takes place at the show adding another
exciting element. High-tech prizes fitting the theme of DesignCon will
be given away to attendees from DesignCon sponsors such as Agilent
Technologies, BERTScope, LeCroy Corporation, Molex, MOSAID
Technologies, Rambus, Inc., Samtec and Tektronix, Inc.
Also on this year's DesignCon exhibition floor will be the
newly-announced DesignVision award winners recognizing the most
successful design tools released in 2006. Many of the industry's best
innovators in electronic design will share their latest developments
Industry professionals can preview these and many other hot
technologies in the Exhibitor Product Guide available at
DesignCon's full exhibitor listing is available at:
For complete information, visit www.designcon.com/2007/ or contact
Lisa Reyes at firstname.lastname@example.org or +1-312-559-3325.